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Dean Tech Co., Ltd
新北市,
Taiwan
Booth: S7537
Overview
Categories
101 Photovoltaic Device Manufacturing
PV: Modules
PV: Stand-Alone Systems
PV-Building-Integrated Solutions
200 Equipment, Assembly
Backgrind; Slicing; Lapping; Polishing Equipment
Cleaning; Washing Equipment for Assembly & Packaging
Cut & Down Set; Trim; Form Equipment
Dicing; Sawing; Scribing; Separation Equipment
Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
Solder Reflow; Soldering & Brazing Equipment
Wafer Level Bonders
Wafer Mount; Taping Equipment
202 Equipment, General Use
Cutting; Drilling; Laser ablation; Beveling Equipment
203 Equipment, Inspection & Measurement
Defect; Particle; Bump; Contamination Detection, Review or Inspection
Microscopes: Atomic Force Microscopes (AFM)
Microscopes: Confocal Scanning Microscope; 3-D Video Microscopes
Microscopes: Optical Microscopes
Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr
Overlay Measurement
Package Inspection; Lead Scanners
Particle Monitors; Analyzers - Airborne or Liquid
Plate Inspection Equipment
Spectrometers; Fourier Transform Infrared (FTIR); Attenuated Total Reflectance FTIR (ATR-FTIR); Auge
Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
Wire Bonding Inspection; Test
X-ray; XRF; 3-D X-Ray; LEXES Systems
206 PV Equipment
Inspection and Metrology
Modules
Thin Film
Wafers
207 Equipment, Process
Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment
Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
Coat; Develop; Resist Processing; Track Equipment
Crystal Growing & Machining Equipment
Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
Environmental Enclosures; Minienvironments
Etching; Stripping; Ashing - Dry and Wet Equipment
Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
Plating; Electro Chemical Plating; Deposition Systems
Wafer Identification; Marking Equipment
300 Materials, Assembly
Thick Film Pastes; Materials
Thin Film; Dielectric Film Materials
301 Materials, Chemicals & Solids
Cleaning Chemicals; Solvents; Strippers
DI; UP Water
Other Specialty Chemicals
307 Materials, Process
CMP; Grind; Lap; Polish; Abrasive materials
401 Sub-systems
Ultrasonic Generators; Transducer and Monitoring Systems
402 PV Systems
Measurement and Control Technology
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Appointment Date*
Wednesday, Sep 04 2024
Thursday, Sep 05 2024
Friday, Sep 06 2024
Start Time*
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End Time*
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Wed Sep, 04
Thu Sep, 05
Fri Sep, 06
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