DSC300 Gen3 - PROJECTION LITHOGRAPHY SCANNER FOR WLP, 2.5D & 3D PACKAGING, BUMPING AND FAN-OUT APPLICATIONS
SUSS MicroTec introduces its next generation projection scanner – the DSC300 Gen3. This proprietary scanning lithography platform touts triple digit throughput with fine (2 μm) resolution capabilities at the lowest cost of ownership (CoO) among 1X projection lithography systems.
MA300 Gen3/MA200 Gen3/MA150e/MA100e - FULL-FIELD LITHOGRAPHY FROM PILOT TO HIGH-VOLUME
Specially designed for high-volume production SUSS automated mask aligner is suited for the automated processing of square substrates and wafers up to 300 mm. It combines leading-edge 1x lithography technology with a variety of innovative features making it the system of choice for thick-resist MEMS applications, 3D patterning over topography, and advanced packaging applications such as 3D packaging, fan-out, bumping as well as compound semiconductor and image sensors.
MA/BA Gen4 Series - COMPACT MASK ALIGNER PLATFORM FOR RESEARCH AND LOW-VOLUME PRODUCTION
The MA/BA Gen4 series represents the latest generation of SUSS MicroTec’s semi-automated Mask and Bond Aligner introducing a new platform system. There are two platform types that differ in configuration. The MA/BA Gen4 is suited for standard processes and the MA/BA Gen4 Pro Series is designed for advanced and high-end processes.
MA12 Gen3/ MA8 Gen5 - SUSS IMPRINT LITHOGRAPHY EQUIPMENT
For the transfer of patterns in the micro- to nanometer range, SUSS MicroTec offers SMILE (SUSS MicroTec Imprint Lithography Equipment) technology. The SMILE process allows very precise imprint of both micro- and nano-patterns, thereby offering a wide spectrum of potential applications and thus excellent process flexibility. For example, SMILE is used in the production of many booming applications such as augmented reality, automotive applications and much more.