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Dean Tech Co., Ltd

新北市,  Taiwan
  • Booth: S7537

Overview

凱勃科技為德國布魯克Bruker Nano GmbH 正式授權台灣地區之總代理，主要負責掃描式微區螢光光譜儀系列之在台銷售與應用, 以及售後維修服務，針對半導體表面有機與無機的非破壞式微汙染分析, 同時提供各式半導體零件的材料與製程測試方法建立.

凱勃科技提供半導體製程清潔/化學研磨/切割/CVD/PVD/廠務的完整解決方案、以日本專利的精密零件來提升製程上的清潔能力、加大機台與設備的頻寬，並提高機台負載量, 達到省水/省氣體與高效率節能, 完全符合ESG的主軸精神. 也針對半導體前段與後段機台的客製化服務, 無須大幅度改裝, 輕鬆升級.

凱勃科技豐富的材料分析與製程改善的經驗，與合作夥伴之專案試機服務，以及各式設備的輕鬆評估與適配.

Categories

101 Photovoltaic Device Manufacturing
  • PV: Modules
  • PV: Stand-Alone Systems
  • PV-Building-Integrated Solutions
    • 200 Equipment, Assembly
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Cut & Down Set; Trim; Form Equipment
  • Dicing; Sawing; Scribing; Separation Equipment
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Solder Reflow; Soldering & Brazing Equipment
  • Wafer Level Bonders
  • Wafer Mount; Taping Equipment
    • 202 Equipment, General Use
  • Cutting; Drilling; Laser ablation; Beveling Equipment
    • 203 Equipment, Inspection & Measurement
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Microscopes: Atomic Force Microscopes (AFM)
  • Microscopes: Confocal Scanning Microscope; 3-D Video Microscopes
  • Microscopes: Optical Microscopes
  • Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr
  • Overlay Measurement
  • Package Inspection; Lead Scanners
  • Particle Monitors; Analyzers - Airborne or Liquid
  • Plate Inspection Equipment
  • Spectrometers; Fourier Transform Infrared (FTIR); Attenuated Total Reflectance FTIR (ATR-FTIR); Auge
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
  • Wire Bonding Inspection; Test
  • X-ray; XRF; 3-D X-Ray; LEXES Systems
    • 206 PV Equipment
  • Inspection and Metrology
  • Modules
  • Thin Film
  • Wafers
    • 207 Equipment, Process
  • Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Coat; Develop; Resist Processing; Track Equipment
  • Crystal Growing & Machining Equipment
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Environmental Enclosures; Minienvironments
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
  • Plating; Electro Chemical Plating; Deposition Systems
  • Wafer Identification; Marking Equipment
    • 300 Materials, Assembly
  • Thick Film Pastes; Materials
  • Thin Film; Dielectric Film Materials
    • 301 Materials, Chemicals & Solids
  • Cleaning Chemicals; Solvents; Strippers
  • DI; UP Water
  • Other Specialty Chemicals
    • 307 Materials, Process
  • CMP; Grind; Lap; Polish; Abrasive materials
    • 401 Sub-systems
  • Ultrasonic Generators; Transducer and Monitoring Systems
    • 402 PV Systems
  • Measurement and Control Technology
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