Green Resource Co., Ltd.

Incheon,  Korea (South)
http://www.greenresource.kr
  • Booth: L1007

  Products

  • Y2O3 High density coating (PVD)
    Y2O3 PVD coating protects semiconductor parts from plasma. It creates a dense yttrium oxide layer via physical vapor deposition. Features: 10 μm thick, >99.9% dense, >1,400 HV hardness. Suitable for parts up to 650 mm diameter....

  • Y2O3 High density coating (PVD) is an advanced plasma-resistant technology by Green Resource for semiconductor components. It uses physical vapor deposition to create an ultra-high density yttrium oxide layer on ceramic parts.

    As semiconductor processes become harsher, especially in dry etching, the need for dense coatings on critical upper components has grown. Y2O3 PVD coating meets this demand, protecting dry etching equipment parts.

    A crucial application is on ceramic windows facing the wafer. These parts are vital as particle generation directly affects process yield, making dense coating essential.

    Key features:

    • Thickness: 10μm
    • Density: >99.9%
    • Hardness: >1400HV
    • Applicable to parts up to 650mm in diameter

    This coating is used in production for both memory and foundry applications. It's also suitable for high-temperature components in deposition equipment beyond dry etching processes.

  • HR-YAG High density coating (PVD)
    HR-YAG PVD coating shields semiconductor parts from plasma. It forms a dense yttrium aluminum garnet layer via physical vapor deposition. Features: 5μm thick, >99.9% dense, >1400HV hardness. Fits parts up to 650mm diameter....

  • HR-YAG High density coating (PVD) is an advanced plasma-resistant technology by Green Resource for semiconductor components. It uses physical vapor deposition to create an ultra-high density yttrium aluminum garnet (Y3Al5O12) protective layer.

    Like Y2O3 coating, HR-YAG coating addresses harsh semiconductor environments, especially in dry etching. It protects critical upper components requiring ultra-high density coatings.

    HR-YAG coating is crucial for ceramic windows facing the wafer during processing. These parts significantly impact particle generation and process yield.

    Key features:

    • Thickness: 5μm
    • Density: >99.9%
    • Hardness: >1400HV
    • Applicable to parts up to 650mm in diameter

    This coating is used in some processes below 5nm node, excelling in hydrogen processes. Its unique yttrium aluminum garnet composition offers advantages in specific semiconductor manufacturing environments.