Y2O3 High density coating (PVD) is an advanced plasma-resistant technology by Green Resource for semiconductor components. It uses physical vapor deposition to create an ultra-high density yttrium oxide layer on ceramic parts.
As semiconductor processes become harsher, especially in dry etching, the need for dense coatings on critical upper components has grown. Y2O3 PVD coating meets this demand, protecting dry etching equipment parts.
A crucial application is on ceramic windows facing the wafer. These parts are vital as particle generation directly affects process yield, making dense coating essential.
Key features:
- Thickness: 10μm
- Density: >99.9%
- Hardness: >1400HV
- Applicable to parts up to 650mm in diameter
This coating is used in production for both memory and foundry applications. It's also suitable for high-temperature components in deposition equipment beyond dry etching processes.