Hypersonic, Inc.

Taoyuan City,  Taiwan
http://www.hpc.com.tw
  • Booth: K2360

Hypersonic will be your best semiconductor solutions gateway

Overview

Founded in 1987, Hypersonic has been a professional semiconductor and electronics industry distributor for decades.

Hypersonic specializes in IC packaging, IC testing, MEMS, Opto electronics, and automation systems.

We provide customers with overall value-added services, including product development, technical support, and process integration. Our business is mainly based in East Asia.

We have 6 sales offices and one manufacturing center in Taiwan and China. These facilities can offer our customers resource-integrated solutions and in-time services. Each member of Hypersonic cooperates closely with principles to provide optimal services to customers.

Our staff consists of an excellent team with sufficient experience in the IC industry. Taking the customer-oriented approach, we focus on providing the best solutions to our customers.

Continuous training and broadening professional technology are what we are always pursuing, which can give the customers the competitive edge to succeed in today’s dynamic market.

For more information, welcome to visit our webiste

www.hpc.com.tw


  Products

  • SPEA
    Your Best Way To Test...

  • SPEA Automatic Test Equipment is used to test semiconductors, MEMS, electronic boards, that are utilized in automotive, consumer, industrial, medical, defense, and other fields.
    Creativity. Innovation. Ingenuity. Since 1976, SPEA designs and manufactures the best automatic test equipment for Semiconductor ICs, MEMS, electronic boards and modules. The company works every day to remain a global leader in this high-tech field.
    From vehicles to smartphones, from tablets to the most complex aerospace, medical, military devices. With SPEA equipment, semiconductor and electronics manufacturers can ensure, day by day, the quality and reliability of their products.
  • MUSASHI
    ​Major : Fully Auto Dispensing system , dispensing module...

  • Major : Fully Auto Dispensing system , dispensing module
    Dispenser for FlipChip underfill,MEMS devices , Camera module and sensors.
    MUSASHI is a complete manufacturer of dispenser , with the overwhelming share of the dispenser market in Japan. MUSASHI is always creating new types of precision liquid control technology for use in complex or just emerging technical fields. 
  • PVATEPLA
    Unique Microwave Plasma Processing systems...

  • Unique Microwave Plasma Processing systems ; batch type plasma and world fastest Strip type plasma
    PVA TePla specializes in unique Batch and Strip-to-Strip Microwave Plasma Processing systems for silicon, compound semiconductors, MEMS, FPD, and solar cell manufacturing.
    For more information please contact: Email: [email protected]
  • PARMI
    ​PARMI inspection system allows you to inspect a full range of devices; from semiconductor products to 40mm of height without special options or inspection speed loss....

  • PARMI system will completely validate your production improvements through detecting concerned defects from solder ball, die pattern, die scratch, die crack, wire bond existence / disconnects, epoxy, and many more.
    Utilizing PARMI’s cutting edge laser technology and tele-centric high-speed camera system enables the system to scan the entire panel including wafer surfaces and recognizes all the different X,Y,Z coordinates comparing to the originally laid out location in full details and renders real time 3D profiles complied with color. Inspection results contain not only the defect information but also real time Z-axis tracking. PARMI system informs the user the condition of entire surface which includes: warpage tracking, Foreign Object Detection (FOD), contamination, and can also be utilized as a precise measuring tool for specialized processes and solutions.
    PARMI technology has been proven in both the SMT & Semiconductor industries as a key provider for real time production solutions that allows users to program with extreme ease, ultimately resulting in lower than average false call rates and escape rates.
  • YIZTECH
    BGA — Yizbond 9246S/ NC7720M
    Lead frame — Yizbond 9699S/ 9246S
    MOSFET solution — Yizbond 9319/ 9319S...

  • Founded in 1996, Yiztech is a high-tech company that designs and manufactures die bonding material of IC assembly industry.
    Because of the technical base in Taiwan, we can provide very instant service through our local agents( Taiwan/ China/ SEA) to meet customers’ satisfaction.
    To care about customers’ demand, Yiztech deeply understands the market requirements and enables to provide the customers’ overall technical solutions. 
    As for the unique technology, we do always prepare the research and development for innovation where needed.
    Aside from these great innovative capabilities, Yiztech always strives to be flexible, concentrates on service, and responds to customer quickly and professionally.
    The most important thing is to support and grow with customers continuously.
    Yiztech product line up — 
    BGA — Yizbond 9246S/ NC7720M
    Lead frame — Yizbond 9699S/ 9246S
    MOSFET solution — Yizbond 9319/ 9319S
  • Hypersonic Inc.
    3rd optical inspection system
    High speed gravity testing handler
    Innovative Paste Printer
    Die Sorting System
    Contact Angle measuring system
    Wafer skeleton inspection system...

  • To provide a simple and manual inspection environment for Die-bonding & wire-bonding products , the system provide convenient functions for hand-free, easy operation, easy change kit and web-service and also avoid the products to be damaged and improve the inspection method and speed.

    Action series gravity handler provides a simple/robust & efficiency/economy handling system for SOP family package in testing. A small footprint machine with short plunger or long plunger option, multi-test site, low jam rate /High UPH and flexible operation interface. Action series provide own socket (Kelvin & non-kelvin) , but also compatible for 3rd party socket. The new application of Action handler is to provide high voltage testing for isolation  

    Multiple substrates stencil printing application with precisely fiducial mark alignment, auto print with motor squeegee, auto clean for stencil and strips auto load/unload. The system provide robust printing quality and high throughput.

    A speedy driver IC sorter equipped with 6 waffle-tray bins, and optional back-side inspection function. The features of the system is to run with the mapping then sort to specified tray/bin with position alignment.

    A full-auto load/unload contact angle measuring system. To provide auto droplet control, auto dispensing and contact angle auto measuring. The droplet dispensing position is also programmable. For the option, HPC provide semi-auto and manual system for contact angle measuring.