Unlock the power of superior thermal management with Heat-Spring®, a cutting-edge soft metal alloy thermal interface material (SMA-TIM) designed to excel in high-performance applications. Crafted as a patterned, pliable metal foil, Heat-Spring® serves as a reliable thermal conduit between compressed surfaces, optimizing heat transfer efficiency. Ideal for a variety of critical applications including TIM2, TIM3, TIM1.5, burn-in tests, and immersion cooling, Heat-Spring® ensures exceptional performance across diverse assembly configurations.
Common package assemblies include:
• Bare die to heat-sink (mobile ICs and GPUs)
• Heat spreader to spreader
• Heat spreader to heat-sink
• Heat spreader board to heat-sink (LEDs)
• Base plate to liquid cold plate (IGBTs)
• Power amplifier to spreader and spreader to plate (power assemblies)
• Spreader to cooling solution
• Test modules (burn-in)