The technology consists of several predictive and analytics manufacturing systems that work together to leverage historical data, aiming to improve yield, cost and reliability.
- Smart reliability control.
- Screen out dice with potential reliability risk, featuring flexible integration into the Map Downgrade System.
- In-process yield prediction that provides valuable feedback for upstream process stages.
- SiC substrate and epitaxy quality monitoring with respect to yield and potential reliability risk.
- Yield Prediction Technology:
- Real time wafer yield prediction, featuring flexible integration with MES.
- Smart Product Routing enables skipping of the Wafer Sort stage if the predicted yield exceeds financially justified threshold.
- Prediction of Know Good Die (KGD) after PCM/Wafer Acceptance.
- Advanced Analytics Platform:
- Root cause analysis of yield excursions including hypothesis suggestion for process adjustments.
- Pattern recognition and wafer map classification.