Overview
InnoLux is setting new industry standards with its groundbreaking Fan-Out Panel Level Package (FOPLP) technology, commitment to transformation into a leading semiconductor player is evident in its innovative technologies by using the largest carrier for Fan-Out Panel Level Package. By setting new standards in performance and efficiency, InnoLux is not just shaping the future of semiconductor manufacturing—it's defining it.
InnoLux FOPLP key business offers various of advanced packaging solutions such as CSP, LGA, QFN, BGA and SiP with Chip-First or RDL-First approaches. Innolux is also a semiconductor component provider of RDL substrate (redistribution layer) and GCS (glass core substrate). RDL and GCS substrates are the trend of making large AI packages, 2.5D packages and packages with slim designs. InnoLux also provides panel level final testing service, which boosts throughput, minimizes handling time, and cuts total operating costs, ensuring top-tier product value and customer satisfaction.
Leveraging our deep expertise and cutting-edge TFT-LCD equipment, we have established a state-of-the-art production line. Working together with some of the best minds in the advanced packaging field, together we are creating pioneering packaging technology, and continuing to revolutionize our vision of "more than panel" every day.
For more Innolux FOPLP related info, please refer to:
https://www.innolux.com/en/product-and-tech/tech/foplp.html
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