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SUSS MicroTec (Taiwan) Co., Ltd.

Hsin-Chu County,  Taiwan
http://www.suss.com
  • Booth: N0476

Welocome to SUSS MicroTec's booth No. 476

Overview

The SUSS MicroTec Group is a leading supplier of equipment and process solutions for microstructuring applications with more than sixty years of engineering experience. 

Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components.

The production of memory chips, cameras for mobile phones or tire pressure sensors – the equipment solutions of SUSS MicroTec are applied within a wide variety of manufacturing processes for applications of daily or industrial use. Customers in the semiconductor industry and related markets like Advanced Packaging, MEMS and LED appreciate our comprehensive experience in wafer processing. This makes us a valuable partner for high-volume production as well as for research and development.


  Products

  • Projection Scanner & Mask Aligner
    SUSS DSC300 Gen3 automated projection scanner
    SUSS MA300 Gen3/MA200 Gen3/MA150e/MA100e automated mask aligner
    SUSS MA/BA Gen4 Series semi-automated mask aligner...

  • DSC300 Gen3 - PROJECTION LITHOGRAPHY SCANNER FOR WLP, 2.5D & 3D PACKAGING, BUMPING AND FAN-OUT APPLICATIONS

    SUSS MicroTec introduces its next generation projection scanner – the DSC300 Gen3. This proprietary scanning lithography platform touts triple digit throughput with fine (2 μm) resolution capabilities at the lowest cost of ownership (CoO) among 1X projection lithography systems.

    MA300 Gen3/MA200 Gen3/MA150e/MA100e  - FULL-FIELD LITHOGRAPHY FROM PILOT TO HIGH-VOLUME

    Specially designed for high-volume production SUSS automated mask aligner is suited for the automated processing of square substrates and wafers up to 300 mm. It combines leading-edge 1x lithography technology with a variety of innovative features making it the system of choice for thick-resist MEMS applications, 3D patterning over topography, and advanced packaging applications such as 3D packaging, fan-out, bumping as well as compound semiconductor and image sensors.

    MA/BA Gen4 Series - COMPACT MASK ALIGNER PLATFORM FOR RESEARCH AND LOW-VOLUME PRODUCTION

    The MA/BA Gen4 series represents the latest generation of SUSS MicroTec’s semi-automated Mask and Bond Aligner introducing a new platform system. There are two platform types that differ in configuration. The MA/BA Gen4 is suited for standard processes and the MA/BA Gen4 Pro Series is designed for advanced and high-end processes.

    MA12 Gen3/ MA8 Gen5 - SUSS IMPRINT LITHOGRAPHY EQUIPMENT

    For the transfer of patterns in the micro- to nanometer range, SUSS MicroTec offers SMILE (SUSS MicroTec Imprint Lithography Equipment) technology. The SMILE process allows very precise imprint of both micro- and nano-patterns, thereby offering a wide spectrum of potential applications and thus excellent process flexibility. For example, SMILE is used in the production of many booming applications such as augmented reality, automotive applications and much more.

  • Lithography Solution - Coater & Developer
    ACS300 Gen2 - Production Spin Cluster for Wafer Level Packaging
    ACS300 Gen3 - Powerful Solution for Advanced Packaging Applications
    ACS200 Gen2 - Combining Expertise with Innovation
    ACS200 Gen2 TE - Fully Automated Platform for Maximum Throughput...

  • ACS300 Gen2 Coater & Developer

    Production Spin Coat / Develop Cluster for Wafer Level Packaging

    The ACS300 Gen2 is a modular cluster system designed to meet manufacturers' needs for clean, reliable, high-throughput and modular photolithography processing for 200 and 300mm wafers. Both wafer sizes can be processed parallel or sequential without any mechanical changeover. SUSS MicroTec ACS300 Gen2 systems can be equipped with process modules for HMDS vapor priming, spin coating, spray coating, aqueous or solvent based developing, baking and cooling. It masters thin and thick resist applications as well as photosensitive polymers like polyimide, PBO and Cyclotene (BCB). SUSS MicroTec ACS300 Gen2 addresses all requirements for sophisticated resist processing and the 3D-Integration and Wafer Level Packaging technology in particular.


    ACS300 Gen3 Coater & Developer

    Powerful Solution for Advanced Packaging Applications

    The modular system of ACS300 Gen3 is specifically designed for demanding high-volume production environments. It provides sophisticated coating, developing and baking functionalities that can be easily adapted to various processes. Maximum process control effectively supports the wide field of use. This, together with the smallest footprint on the market for a system with eight spinner modules, all qualities positively affecting cost-of-ownership, make the tool indispensable for any challenging advanced packaging application such as wafer-level chip-scale packaging, fan-out wafer-level packaging, copper pillar flip-chip packaging and 3D packaging.


    ACS200 Gen3 Coater & Developer

    Combining Expertise with Innovation

    The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM. The enhanced version of the platform, ACS200 Gen3 TE, increases flexibility even further with up to 6 spinner and spray modules and an integrated inkjet module.


    ACS200 Gen3 TE Coater & Developer

    Fully automated platform for maximum throughput

    The SUSS ACS200 Gen3 TE platform takes the very successful and well-known ACS200 Gen3 platform to a new level. It increases throughput and makes operation and maintenance more comfortable. The SUSS ACS200 Gen3 TE offers unmatched configuration flexibility of modules and technologies, thus covering the requirements of Advanced Packaging, MEMS, LED, and other markets and serving R&D as well as HVM.

  • Photomask Solutions - Photomask BD & Cleaning tool
    MaskTrack Pro offers unique combination of physical and chemical cleaning technologies for surface preparation and passivation that enable customers to effectively remove all contaminations while preserving mask integrity down to x nm technology node....

  • Wet Cleaning

    Physical-based Cleaning

    Offering multiple physical force technologies for wet cleaning the system consists of up to three pre-clean and final-clean chambers for segregation of strip, pre-clean and final clean processes.

    • Unique in-situ UV surface preparation and cleaning technology

    • High frequency dual megasonic cleaning up to 4MHz

    • Precision nano binary spray

    • Focus Spot Cleaning

    Chemical-based Cleaning

    • DIW-H20 degassing for cavitation control during megasonic process

    • Ultra-clean hot and cold CO2-DI water

    • Ozonated DI water and electrolyzed H2 incl. pH stabilization

    • Ultra-diluted SC1

    • New alkaline-based media for further pattern damage reduction

    • 15 nm process media filtration

    Surface Treatment

    Sophisticated Preparation, Preservation and Restoration

    • High temperature dehydration and ion removal for 193i photomasks

    • Soft RTP dehydration and surface restoration specifically for EUVL

    • 172nm UV exposure

    • Environmentally controlled mask storage

    Process Automation

    Intelligent Solutions

    • Wet substrate transfer between pre-clean and final clean process

    • Dry flip functionality

    • Low contact dual substrate transfer handling

    • Multiple input/output and substrate buffer stations

    • Online process monitoring via webcam

    Standards

    In Line with the Industry

    • SEMI S2, S8, S13 compliant

    • CE marked

    • Conform to European harmonized standards and machine directive 2006/42/EC, EMC directive 2004/108/EC and low voltage directive 2006/95/EC

    • DIN ISO 14.644 class 2 controlled environment

    • Ready for factory automation via SECS/GEM 200/300 mm standard interface

  • Wafer Bonder
    SUSS MicroTec’s wafer bonding platforms combine over seventy years of microstructuring experience with solid product quality and a broad range of productivity features....

  • XBC300 Gen2 D2W/W2W

    World’s first hybrid bonding allrounder for 200 mm and 300 mm substrates

    The new XBC300 Gen2 D2W/W2W cluster is the only platform in the world to integrate all existing hybrid bonding processes in a single tool: W2W, collective D2W and sequential D2W. Compared to traditional stand-alone W2W and D2W clusters, the XBC300 Gen2 D2W/W2W offers a significantly reduced footprint. Investment costs are considerably lower because process modules that are redundant in separate stand-alone systems are only needed once. In addition to the process modules required for W2W bonding with industry-leading alignment accuracy of < +/- 50nm, the XBC300Gen2 D2W/W2W features an integrated NEO HB die bonder from technology partner SET Corporation SA, offering +/-100nm alignment accuracy. A high-precision and throughput-optimized metrology station enables in-line verification of the alignment accuracy of both W2W and D2W bonds across all processes.

    Highlights

    • Ideal for Research and Technology Organizations (RTOs)
    • Enabling parallel development and qualification of hybrid bonding processes
    • Integrated state-of-the-art flip-chip die bonder from SET Corporation SA
    • D2W transfer with very low inter-die spacing at maximum yield
    • Consistent ultra-high alignment accuracy
    • Closed-loop feedback between integrated metrology and bond aligner

    XBS300 W2W Hybrid Bonding Platform

    Permanent Wafer Bonding Platform for R&D and High-Volume Production

    The universal XBS300 W2W platform is designed for (hybrid) fusion bonding of aligned 200 mm and 300 mm wafers. Its highly modular design offers maximum configuration flexibility at low cost-of-ownership for customers. Different configurations are available to meet the requirements in both R&D and high-volume manufacturing (HVM) environments. The new XBS300 hybrid bonding platform allows for both collective D2W (die-to-wafer) and W2W (wafer-to-wafer) hybrid bonding focusing on most demanding applications such as 3D stacked memory or 3D SOC (system-on-chip).

    Highlights

    • Industry leading < 100 nm (3σ) overlay
    • High-performance integrated metrology
    • Reflective IR option
    • Compatible with silicon or glass carriers
    • Closed-loop feedback between integrated metrology and bond aligner

    XBS300 Temporary Bonder

    Universal Temporary Wafer Bonder for High Volume Manufacturing

    SUSS MicroTec‘s XBS300 platform for temporary bonding represents the next generation of high-volume manufacturing temporary bonder solutions. The 200/300mm wafer bonding platform can be configured for a low cost of ownership and maximum process flexibility.

    Highlights

    • Open bonding platform supporting flexible configuration and all common adhesives and techniques
    • Coating of bonding and release layers, including temporary bonding, in one system
    • Integrated metrology to determine wafer thickness and TTV

    XBC300 Gen2 Debonder & Cleaner

    Open Platform for More Flexibility

    The XBC300 Gen2 debonder and cleaner platform is designed for processing wafers of 200 and 300 mm in size as well as oversized carriers. Sophisticated processing allows for handling of tape mounted device wafer as thin as 30 µm or even below. Its advanced process versatility reaches from mechanical peel-off and excimer laser-assisted debonding to cleaning capabilities for thinned wafer and carrier wafer. Hereby the XBC300 Gen2 offers a comprehensive solution for 2.5D and 3D integration applications.

    Highlights

    • Open platform supporting various materials and technologies
    • Room temperature debonding technologies
    • Tape mounted thin wafer cleaning with tape protection
    • High throughput

    XBS200 Wafer Bonder

    Wafer Bonding Platform for High-Volume Production

    The universal XBS200 platform allows for aligned wafer bonding of wafer sizes up to 200 mm. Its versatility and modular design offer maximum process flexibility in all permanent bonding tasks. A novel aligned wafer transfer method eliminates the complexity of traditional systems and offers consistent process results with excellent system availability. The XBS200 platform offers low cost of ownership for high-volume production of MEMS, LED and 3D advanced packaging.

    Highlights

    • Submicron alignment accuracy
    • Integrated metrology option
    • Unique laser pre-bond option
    • High process repeatability
    • Low cost of ownership
  • Inkjet Printer
    Inkjet printing is very versatile. It can be used for direct material deposition for patterned or homogeneous coatings, from tens of nanometers to tens of micrometers. It can also be used as a 3D printing method....

  • JETxSM24

    Solder Mask For PCB With The Award-Winning SUSS JETxSM24 Inkjet Printer

    Inkjet printing means fewer process steps compared to traditional solder mask coating or Laser Direct Imaging (LDI). Photo and development processes are eliminated as is the need for full surface flooding. This speeds up production while reducing waste, material, and energy consumption.

    Achieve more with less:
    Your benefits

    Productivity – Up to 32,000 nozzles

    • Integrates High-Mix Low-Volume (HMLV) and Low-Mix High-Volume (LMHV) production
    • Slims down operations and speeds up manufacturing
    • Delivers a rapid return on investment

    Efficiency – Up to 80% material saving

    • Aligns with current Environmental, Social, and Governance (ESG) strategies
    • Reduces waste and minimizes environmental impact
    • Applies material only where it's needed

    Precision – Up to 42 billion drops per panel

    • Five micrometer coating thickness accuracy
    • Additive manufacturing that reaches the edge of the copper
    • Superior circuit board quality

    JETx

    Inkjet Printing Solution for High Volume Production

    The JETx inkjet printer for high volume production is SUSS MicroTec’s most advanced solution for printing functional materials, specifically designed for the semiconductor and adjacent markets, such as power electronics, sensors, MEMS, display and biomedical.

    The JETx, combined with a material handling unit, such as the ACS200 Gen3 TE, and a hotplate stack offers a complete production solution designed for a low cost of ownership with high throughput for round wafers up to 300 mm and panels up to 24” by 30” (610 x 765 mm).

    Highlights

    • Green process
    • Fully integrated production solution
    • High reliability, productivity with low cost of ownership
    • Customizable configuration optimized for your process
    • Compatible with solvent-based, aqueous, hot melt and UV-curable inks
    • Easy to operate and maintain

    Main features and options

    • Fully automated production solution
    • Green process
    • Virtually zero material waste
    • Minimal floorspace
    • Individualization of products by digital processing
    • Non-contact deposition for fragile substrates
    • Micrometer control of layer thickness
    • Integrated pre- and postprocessing options
    • Continues operation during refill
    • Automatic process inspection

    LP50

    Advanced research inkjet printer

    SUSS LP50 inkjet printer with PiXDRO technology is designed for research and development of inkjet processes and applications.

    The SUSS LP50 is a desktop R&D inkjet printer for functional printing applications. It is designed for the research and development of inkjet processes and applications, as well as the evaluation and development of inkjet materials.

    The SUSS LP50 platform is an open, accurate, flexible, and easy-to-use system that will allow you to work at the cutting edge of inkjet printing technology. It is designed for a wide range of applications such as semiconductor packaging, PCBs, printed electronics, photovoltaics, displays, and biomedical.

    Highlights

    • High accuracy motion systems
    • Fast and accurate exchange of printheads and inks
    • Open architecture enables user-defined and application-specific functionalities
    • Automated printhead maintenance (capping, purging, spitting, wiping)
    • Easy transfer of process recipes to PiXDRO production printers

    Main features and options

    • Advanced Drop Analysis (ADA) for best ink jetting performance
    • Automatic Print Optimization (APO) for best application results
    • Substrate chuck cooling
    • Dual printhead configuration
    • Ink tank heating
    • UV LED pinning
    • Customized substrate holders
    • Glovebox integration for inert environment
    • JS20 printhead storage station
    • Printer table with storage cabinet and monitor/keyboard swing arm
    • Advanced Gerber File Rasterizer