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Jipal Corporation
Hsin Chu,
Taiwan
http://www.jipal.com
Booth: L0616
Overview
Welcome to Jipal,
Jipal Corporation
–
We are an engineering services company.
Jipal was established in June 1990, dedicated for SEMICON Back End Packaging Equipment, Material selling, and full coverage of technical consult and product service support.
Territory started from Taiwan, extended to China and SEA, over 20 locations of Jipal offices among of Asia.
Our Principals
–
AEMULUS
AIMECHATEC
AMESS
Aurigin
CAPABLE
Centrotherm
EMAGE
FURUKAWA ELECTRIC
FASFORD TECHNOLOGY
GSP
GREATECH
HOVER-DAVIS
INTELUME
ITW EAE
KINIK
KINERGY
KLA
KOBAYASHI & CO., LTD
Legend
MARS TOHKEN (Hitachi High-Tech)
MKE
NIPPON KAYAKU
Okamoto Machine Tool Works. LTD
ORION SYSTEMS INTEGRATION
PAL
REALIZE
TEIKOKU
UBCT
XST
Jipal always back you up!
Website:
www.jipal.com
E-mail:
sales@jipal.com
TEL:
886-3-5725325
Categories
200 Equipment, Assembly
Backgrind; Slicing; Lapping; Polishing Equipment
Ball Placement; Attach Systems
Base Loader Systems
Cleaning; Washing Equipment for Assembly & Packaging
Cut & Down Set; Trim; Form Equipment
Device Handling; Feeding Systems
Dicing; Sawing; Scribing; Separation Equipment
Die Bonding; Attach Equipment
Die Sorter; Pick & Place; Flip Chip Placement Systems
Dispensing Systems
Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
Molding; Encapsulation; Decapsulation Equipment
Package Handling; Conveying Equipment
Solder Reflow; Soldering & Brazing Equipment
Tape Automated Bonding (TAB); Bumped Tape Automated Bonding (BTAB) Equipment
Wafer Level Bonders
Wafer Mount; Taping Equipment
202 Equipment, General Use
Cutting; Drilling; Laser ablation; Beveling Equipment
Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
Lamination; Sheet Laminating Equipment
203 Equipment, Inspection & Measurement
Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
Wire Bonding Inspection; Test
X-ray; XRF; 3-D X-Ray; LEXES Systems
207 Equipment, Process
Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
208 Equipment, Test
Linear Test Systems
Logic Test Systems
Memory Test Systems
Optical Test Systems
Package Test Systems
300 Materials, Assembly
Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
Package Substrates; Laminate; Film based
302 Materials, FPD
Alignment Film Materials
502 Material Handling Systems
Conveying; Material Handling Systems
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Appointment Date*
Wednesday, Sep 04 2024
Thursday, Sep 05 2024
Friday, Sep 06 2024
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Wed Sep, 04
Thu Sep, 05
Fri Sep, 06
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