Your Test and Inspection Partner. Visit us at booth #I2800.
Overview
Test Research, Inc. (TRI) offers a One Stop Test and Inspection Solution. TRI provides high-precision and high-resolution inspection solutions for the electronics manufacturing industry, including 3D Solder Paste Inspection (3D SPI), 3D Automated Optical Inspection (3D AOI), 3D Automated X-ray Inspection (3D AXI, upgradable to Computed Tomography), Manufacturing Defect Analyzers (MDAs), and In-Circuit Test equipment (ICT).
TRI's Smart Factory innovations optimize the current Inspection through AI-powered algorithms, multiple 3D technologies, metrology-grade measurement, real-time SPC trends, and M2M communications. TRI's solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, the IPC-DPMX, and the Connected Factory Exchange (IPC-CFX).
TRI's AI-powered Inspection solutions for the Semiconductor and Advanced Packaging Industry can inspect Die / Wire / Wedge / Ball / Ribbon Bonding, Cross Wire, BBOS/BSOB, SiP, WLCSP, Underfill, Bumps, Cu Pad/Pillar, Epoxy, Flux, Glue, and foreign material detection.
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| Die Bonding | | | AI Wire Detection | | | IGBT Inspection | | | Wafer Chip Metrology | | | Scratch on Die |
For more information about TRI's Inspection capabilities for the Semiconductor and Advanced Packaging Industry, please visit the link below,
https://www.tri.com.tw/en/about/about-68-2-2.html
Visit booth #I2800 to discuss TRI's Semiconductor and Advanced Packaging Industry Inspection Solutions with our staff.