MICRONOX MX2708 is a single-phase cleaning agent formulated for the demanding cleaning challenges presented within advanced packaging devices such as low standoff gaps and fine pitches of Cu pillar flip chips, 2.5D/3D ICs, SiP and wafer level packaging. MX2708 completely removes all types of water soluble (OA) flux residues at low operation concentrations while having no effect on exposed metal and intermetallic alloys including Cu, Al, Sn, Pb, Ni, Ag and Au finishes.
- Effectively Cleans Under Highly Dense Die Without Reacting with Exposed Metals
- SAC, Aluminum and Copper Safe
- Lowers Surface Tension
- Superior Rinsing Ability