Mitsui Mining & Smelting Co., Ltd.

Shinagawa-ku,  Tokyo 
Japan
https://www.mitsui-kinzoku.com/
  • Booth: L1105

Overview

Manufacturing and sale of functional engineered materials and electronic materials, nonferrous metal smelting, minerals resource development, precious metal recycling, raw material related businesses, manufacturing and sale of automotive parts/components, etc.


  Products

  • NANOBIX™
    NANOBIX is an excellent polishing slurry including MnO2 abrasive and KMnO4 oxidant for high grade SiC epi-ready wafers which is used for EVs and renewable energy. NANOBIX can polish SiC wafers with excellent speed and less sub-surface damage....

  • NANOBIX is an excellent polishing slurry including MnO2 abrasive and KMnO4 oxidant for high grade SiC epi-ready wafers which is used for EVs and renewable energy. NANOBIX can polish SiC wafers with excellent speed and less sub-surface damage.

  • Negative Thermal Expansion Materials
    We have developed revolutionary NTEs with wide coefficients of thermal expansion ranging from -12 to -66 ppm/K. We expect our NTEs to be widely used in your developments and products....

  • Negative Thermal Expansion (NTE) materials are used to suppress the thermal expansion of materials such as resins and plastics, which exhibit larger NTE effects than widely used low thermal expansion materials such as SiO₂. We have developed revolutionary NTEs with wide coefficients of thermal expansion ranging from -12 to -66 ppm/K. We expect our NTEs to be widely used in your developments and products.

  • MicroThin™ – Ultra thin copper foil
    MicroThin™ features selectable thicknesses ranging from 1.5µm to 5µm,
    With 12µm or 18µm releasable carrier copper foil.
    The carrier foil can be easily removed after lamination to the substrate, resulting in a uniform thin copper layer....

  • MicroThin™ features selectable thicknesses ranging from 1.5µm to 5µm,

    With 12µm or 18µm releasable carrier copper foil.

    The carrier foil can be easily removed after lamination to the substrate, resulting in a uniform thin copper layer.

    MicroThin™ is utilized in fine line circuits for high-end PCBs,

    Particularly in substrates for FC/WB-CSP, BOC, SLP, mmW antennas, and other advanced applications.