MicroThin™ features selectable thicknesses ranging from 1.5µm to 5µm,
With 12µm or 18µm releasable carrier copper foil.
The carrier foil can be easily removed after lamination to the substrate, resulting in a uniform thin copper layer.
MicroThin™ is utilized in fine line circuits for high-end PCBs,
Particularly in substrates for FC/WB-CSP, BOC, SLP, mmW antennas, and other advanced applications.