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Shenzhen Huaxin Intelligent Equipment Co.,Ltd.

深圳,  China
  • Booth: N1182

  Products

Categories

200 Equipment, Assembly
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Wafer Level Bonders
    • 205 Equipment, Nanotechnology
  • Equipment, Nanotechnology Tools
    • 207 Equipment, Process
  • Wafer Identification; Marking Equipment
    • 309 Materials, Test
  • Test Sockets; Contactors and Contact accessories
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