PEMTRON

SHENZHEN,  China
http://www.pemtron.com
  • Booth: P5606

See the Invisible World!

Overview

About PEMTRON

See the Invisible World– Pemtron develops the best inspection equipment with the world's best technology.

Based on our original 3D precision measurement technology, 3D SPI and 3D AOI are developed and supplied to SMT and electronic manufacturing processes such as semiconductors, mobile phones, displays, and to automotive industry.

Based on the world's best inspection technology, we are continuing to expand our business to new areas by releasing new equipment that the market needs, such as Package AVI, Memory Module AVI, Wafer Inspection system, AI (Artificial Intelligence) applied visual inspection system.

We believe that the priority is our customers, and all our executives and employees are committed to continuing research
and development for customer satisfaction with the world's best technology.

We will not stay in the present but will continue to develop into the spirit of challenge, customer satisfaction, and quality management to become the best company in the world.

PEMTRON's China application and demo center is located in Shenzhen and Suzhou.
All technologies are available here for testing, demonstrations and training.

PEMTRON Products

•Package AVI
•Memory Module AVI
•Wafer Inspection (WI)
•Automatic Optical Inspection (AOI)
•Solder Paste Inspection (SPI) 
•Coating Thickness Inspection (CI)
•X-ray Inspection
•Other test and inspection systems


  Products

  • ZEUS
    3D Wafer Bump & Wire Bonding AOI Inspection system.
    ...

    • Highest quality 3D Wire-Inspection.
    • With high-resolution, complete inspection is possible even for Foot-shape.
    • Inspect Mirror-surface without Reflection problem.
    • As for PEMTRON'S unique optical technology, Coaxial lighting was applied to 3D installation.
    • All Packages including SIP / FCBGA / FOWLP / FOPLP / WLCSP can be dealt.
    • AOI + SPI Multi-Hybrid System.
    • With high resolution quality, inspection of small and dense parts such as Bump, Mini LED, parts lower than 009004, etc. are optimized.
  • 8800WI
    Wafer Bump 3D Vision Inspection...

    • Conduct with PASS Buffer when REWORK Part with Multiple NGs
    • Function to start manufacturing with the REWORK Parts during INSPECTION ATM Check
    • Apply the LOAD PORT substitute loading system during UNLOADER PART ATM inspection
    • AIR CHUCK Works on Both 8-inch(200mm), 12inch(300mm) WAFER
    • Users can output and monitor the designated DATA by Using the self-developed SPC SW, such as data, defective images, and charts.
    • PEMTRON SMARTRON server system allows user to view and control each device through one operation PC to monitoring the operational status and SPC DATA of all equipment
    • Using 3D Inspection Methodology to process the BUMP Inspection
    • Reduce resources to check and debug the fault defects based on the outstanding inspection precision
  • Apollon
    Automatic Visual Inspection
    ...

    • TRAY BASED INSPECTION
    • It accommodates a variety of package handled by the tray such as BGA,LGA,GFN,QFP,CSP,SOP, etc
    • 3D double loading inspection
    • It does not only identify OK and NG, it also inspects double-loaded material More accurate double loading inspection is performed by 3D inspection method compared to laser method.
    • Accurate SPC process management system
    • 3D image storage and NG review function without tray handling in the eequipment
  • Mars
    Memory or SSD Final testing AVI Machine....

  • Tailored Solutions for Memory Modules

    •   Customizable Inspection Parameters:   Fine-tune inspection protocols to match memory module manufacturing intricacies.

    Efficiency-Driven Automation

    •   Automated Inspection Workflows:   Streamline production operations with automated inspection processes.
    •   Auto Tray and PCB Cleaning:   Eliminating contaminants and debris to ensure outgoing quality, minimizing downtime and maximizing productivity.

    Enhanced Yield Management

    •   SPC Integration:   Achieve comprehensive traceability and quality control with Statistical Process Control (SPC) functionality.
    •   Real-Time Defect Identification:  Receive instant feedback on defects for prompt corrective action.
    •   Maximized Yield Rates:  Proactively identify defects to maximize yield rates and minimize scrap.

     

  • POSEIDON
    Wafer Warpage Measurement and FC-BGA Bump Inspection...

  • Solution for Wafer Warpage Measurement

    • Quickly and accurately measures warpage across the entire wafer surface
    • Analyzes flatness and coplanarity based on accurate 3D data
    • Accurately measures target deviation, quickly providing profile and mapping data

    Solution for FC-BGA Bump Inspection

    • Identification of fine defects with high-resolution image implementation
    • Various inspections such as PCB Warpage, Bump Height, Bump Coplanarity, Bridge, Large Bump, Missing Bump based on accurate detection
    • Inspection of various processes such as Wire Bonding, Bumped Wafer, and Micro LED etc.
    • Accurate parameter measurement through 3D measurement and profiling