Semicaps Pte Ltd

Singapore,  Singapore
http://www.semicaps.com
  • Booth: L1126

Overview

SEMICAPS is the world’s leading company in high resolution infra-red laser scanning microscopes for the semiconductor field. These microscopes are used by advanced semiconductor companies for:

a) design-debug analysis of new integrated circuits (ICs),
b) yield improvement analysis for early semiconductor wafers, and
c) failure analysis of customer returns.

Currently, SEMICAPS equipment has the best resolution in the world with the ability to resolve linewidths below 70nm. This allows our equipment to be used currently on the 3nm, 5nm and 7nm technology node and beyond by leading customers in the semiconductor field. On top of that, our SEMICAPS 5000 is the only wafer prober in the field that allow hard-docking and direct-probing with standard commercial testing equipment; catering for probe-cards of over 10,000 pins and testing speeds of more than 1 Gbps. All these are possible through advanced Research and Development in house.

In the design and manufacturing of semiconductors, SEMICAPS equipment provides foundries, design houses and packaging houses with solutions for Electrical Failure Analysis, Fault Isolation and Failure Characterization as our core business. Our tools are usually located within Failure Analysis labs, Quality Analysis labs, Quality Reliability labs, Process and Yield Enhancement facilities, third party FA labs, Government Institutions, Research Labs and Institutes of Higher Learning to name a few.  We sell these globally to leading semiconductor IC companies like Samsung, Qualcomm, AMD, NXP, GlobalFoundries, OnSemiconductor, Skyworks, Micron, Intel, UMC and TSMC as well as Mainland China customers in Beijing, Chengdu, Shenzhen, Shanghai and Wuhan.  Over Half of the top 20 semiconductor companies have bought our equipment.

Our subsidiary, Inscope Labs also provides a wide range of laboratory services using our equipment.

SEMICAPS has its R&D, manufacturing and HQ in Singapore. SEMICAPS has an established reputation in the semiconductor industry for more than 35 years inventing  and commercializing many world's firsts. 


  Products

  • ARSIL
    The ARSIL is used for the laser scanning and probing of advanced semiconductor nodes, especially in design-debug yield analysis....

    • Being used by leading manufacturer for the 14 nm technology node
    • Elminate the need for wafer backside thinning
    • Compatible for both inverted and upright systems
    • Rapid Image Shift Mode (RISM)
  • Configuration
    We have
    SEMICAPS 1100
    SEMICAPS 3000
    SEMICAPS 4000
    SEMICAPS 5000...

  • SEMICAPS 1100

    For backside and frontside analysis of wafers, wafer parts and packaged devices

    SEMICAPS 3000

    For backside and frontside analysis of wafers, wafer parts and packaged devices. Able to dock with all ATE platforms.

    SEMICAPS 4000

    Analytical or ATE docked configuration.

    SEMICAPS 5000

    Wafer analysis using a combination of Laser Timing Probe (LTP), Scanning Optical Microscope (SOM), Photon Emission Microscope (PEM) and Thermal Microscopy (THM).

  • Laser Timing Probe (LTP)
    The SEMICAPS Laser Timing Probe uses a laser to contactlessly probe for waveforms in the internal gates of an integrated circuit (IC)....

    • Non-invasive backside detection of waveforms/logicwithin a die using a CW laser
    • FFT Frequency Mapping to quickly trace signal paths inside a die
    • Best-in-class
      • Resolution with Centric and Aplanatic RSILs
      • Bandwidth up to 12 GHz
      • Test loop lengths up to 1000 ms
      • Measure rise times < 40 ps
    • Optional:
      • SOM with 1064 nm and 1340 nm lasers
      • PEM with ultra low-noise InGaAs camera (LN2 or TE-cooled)
    • Device Thermal Control
  • Photon Emission Microscopy
    Main applications for the Photon Emission Microscope is to locate failures like leaky junctions, contact spiking (due to ESD), latch-up, oxide breakdown, and other current leakage phenomena that produce light emissions....

    • Uses a highly automated hardware and software system which can be switched to a manual mode when desired
    • Stage movements is fully controlled from the computer console via the X, Y and Z buttons on the user interface screen or by joystick control
    • Detectors and optics are automatically moved into and out of position from the optical path depending on the imaging mode (Live or Capture) chosen
    • On selecting Backside Imaging, the NIR filter is automatically positioned into the optical path
    • a user-friendly Window-based system which supports functions like real-time frontside and backside imaging, image acquisition and overlay, and other processes to simplify FA operations
    • Allows live stage navigation using a user-interface window with its dual camera system
    • DUT can be continously monitored and inspected without opening the light-tight enclosure
    • Coordinate registration system enables users to interface with almost any third party CAD software (eg. Knights)
    • Par center and par focus are software corrected so that the image center and focus do not change with different objectives
    • Extensive tools like image processing, annotation and customized data reports are available in the software
    • An automated removable NIR filter, optimized optics and light source, SEMICAPS PEM series offer both frontside and backside imaging as standard features in one integrated system
  • Scanning Optical Microscopy
    The instrument is an integrated compucentric system designed for maximum ease of use and flexibility. It is optimized for high laser power delivery, sensitivity and spatial resolution....

    • Lasers option – 1340 nm/ 1320 nm / 1064 nm with laser scan array size up to 2k x 2k
    • Multiple techniques available
    • static: TIVA, OBIRCH
    • dynamic: LADA, SDL
    • High power delivery 30 mW at  DUT for all objectives including 100x
    • Lock-in and Laser Pulsing technique: 10x improvement in sentivity
    • Pixed by pixel flexible scanning mode with user defined multiple – AOI
    • Module platform, field-upgradeable to LTP
    • Flexible and customizable
    • Centric and Aplanatic Refractive Solid Immersion Lens (RSIL) options
    • Option to mount PEM cameras (InGaAs, TE-Cooled, LN2)
  • Thermal Microscopy
    The THM may be used to locate a range of defects in a semiconductor deivce, like short circuits, oxide breakdowns, device latch-up and leakage currents
    Lock-in Thermography improves localization by minimizing hotspot dilation...

    • Analytical or tester-docked, upright or inverted configurations
    • High resolution stirling-cooled MCT detector
    • 3 positions angled objective turret
    • Navigation CCD for high resolution background overlay
    • Automated detector parcentering
    • Room temperature imaging
    • Incorporate into combine microscope
    • Par-focus
    • Large format for better FOV
    • LN2 option available
    • Hi-resolution option available
    • Large format option available
    • Lock-in thermography option
    • Montage option