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TECH PLUS PRECISION MACHINERY INDUSTRY CO., LTD.

Taichung City,  Taiwan
http://www.tech-plus.com.tw/
  • Booth: L1127

Overview

TECH PLUS specializes in Double-Column High Speed Engraving and Milling Machines since 2006.  It offers high precision Micro Drilling Machines, Panel Processing Machines, Glass Grinding Machines, and 4-Axis & 5-Axis Machining Centers.  Each machine is standard equipped with Built-in Motorized Spindle, the max. spindle speed is up to 40,000 rpm which can achieve high processing efficiency & ultra performance working with smallest tooling diameter of less than Ø0.1mm on hard and fragile materials in semiconductor field.  TECH PLUS provides holistic solutions for quality assurance.  Our Turnkey Solutions encompass fixture design, drawing analysis, software optimization, and more.  Furthermore, we support plant planning, equipment programming, and automated production line planning, aiming to achieve high-quality, cost-effective production.  TECH PLUS stands committed to enhancing efficiency, profitability and customer success within the high-value product market.

  Products

  • DB-5D High Speed Micro Drilling Machine
    DB-5D is double column high precision micro drilling machine, equipped with high-end Motorized Spindle of max. speed 40000rpm, well regarded on working with smallest tooling diameter of less than Ø0.1mm on hard & fragile materials in semiconductor field....

    • Counter-positioning on Z axis structure combined with offset design on X-axis guide ways and 90° reverse linear guideway, supporting the high stability & excellent performance during machining.
    • More rigid and stable double-column structural design which can reduce the vibration effect in high speed machining, improve the contour accuracy and result in the utmost surface finishing on works, and better tool service life.
    • Standard equipped with HSK-E32 30,000rpm Built-in Motorized Spindle, presenting high speed and low power consumption.
    • Optional Ultrasonic Machining Tool Holder to effectively reduce cutting resistance, prolong tool life, improve processing efficiency and optimize the quality of precision machining.
    • Equipped with European linear enclosed absolute encoder with high-resolution 0.04 μm.
    • Minimum Drilling Capability: 0.03 mm
    • Accuracy: +/-0.003 mm
    • Applications: Semiconductor hard & fragile test components, Vertical Probe Cards, BGA Socket, Al₂O₃, ZrO2, Quartz, Graphite, SiC, glass wafer cutting and grinding, and etc.

Categories

202 Equipment, General Use
  • Cutting; Drilling; Laser ablation; Beveling Equipment
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