Chip bonding materials for IC packaging and LED packaging
Overview
Suzhou Xinhe Semicon was established on March 11, 2021.The registered capital is 9 million dollars. Our company is based in No. 6, Liangfu Road, Chengxiang Town, Taicang City and the marketing and R&D center is located in Shanghai.
Our company is mainly engaged in the R&D and manufacturing of semiconductor chip bonding materials, namely capillary, capillary are widely used in semiconductor IC packaging and LED packaging, it is the core material of chip packaging and bonding process.
The company is the first fully localized ceramic capillary R&D and manufacturing enterprise in China's high-end marketg. With more than 30 professional technical team with 10+ years of working experience in the field of ceramic capillary. In ceramic raw material preparation、 molding process、surface treatment、equipment research and development and other aspects of the core technology completely independent and realized mass production, has passed the certification of several major customers at home and abroad and obtained orders.
Our company is focusing on the high-precision ceramic industry while actively launching new material business. Our company is committed to becoming the global leader in bonding materials for semiconductor chips.
Products