GBG Technology Co.,Ltd.

Fabmatics has the unique competence to offer customer-specific solutions for the use under cleanroom conditions:

• Mobile robots (AMR, AGV, RGV)
• Cobots
• Robot cells
• Conveyor Solutions
• Automated storage systems (Stockers, Purging, Test wafer management)
• Test wafer management
• RFID solutions
• Input-/output-stations
• Software 
• Consulting (Fab assesments, fab simulation and vizualisation etc.)
• Third Party Service

Each one of our products and solutions can be added and integrated seamlessly into new and existing production lines - always adapting to our customer's needs.

Explore how Fabmatics' and SCI's automation solutions fit into your production environment and elevate your fab's performance, setting new standards for productivity and competitiveness. 

Automation from a single source and fully integrated! 

Learn more:
http://www.gbgtek.com.tw/en_US/category/fabmatics/

LINEAR HOIST Application
The Linear Hoist is our Overhead Transport Systems (OHTS) as well as storage system for the automated storage and retrieval and delivery of different wafer carrier types and/or tools throughout the intrabay. This is a support system of precision and efficiency paramount in the production of microelectronic devices, serving as a bridge between different tools and equipment, that ensures a smooth flow of production while maintaining product integrity and cleanliness.

LINEAR STOCKER Application
The Linear Stocker is our midsized storage system designed for the automated storage and retrieval of semiconductor wafer carriers, tools or reticles, throughout various stages of the manufacturing process. This is a support system of precision and efficiency paramount in the production of microelectronic devices, serving as a bridge between different tools and equipment, that ensures a smooth flow of production while maintaining product integrity and cleanliness.

MAX STOCKER Application
The Max Stocker is our largest storage system designed for the automated storage and retrieval of semiconductor wafer carriers throughout various stages of the manufacturing process. It is also currently the largest stocker of its kind on the market. This is a support system of precision and efficiency paramount in the production of microelectronic devices, serving as a bridge between different tools and equipment, that ensures a smooth flow of production while maintaining product integrity and cleanliness.

RADIAL STOCKER Application
The Radial Stocker is our smallest and most compact storage system designed for the automated storage and retrieval of HA 200 or OC wafer carriers, tools or reticles, throughout various stages of the manufacturing process. This is a support system of precision and efficiency paramount in the production of microelectronic devices, serving as a bridge between different tools and equipment, that ensures a smooth flow of production while maintaining product integrity and cleanliness.

TRANSPORT SYSTEMS Application
Schillers Cleanroom Transport System is designed to transport wafer carriers, equipment, and/or materials between different stages of the semiconductor manufacturing process efficiently and with extreme care. Highly automated, with sensors, controls, and software ensure precise movement, positioning, and synchronization of materials and wafers throughout the fab. This automation minimizes the risk of human error and maintains a controlled and clean manufacturing environment. The design of the conveyor system can vary depending on the specific manufacturing process and the layout of the facility. The core is the Schiller Cleanroom Conveyor, consisting of clean-room-tested components and the innovative Magnetic Drive technology for contactless and frictionless power transmission to the rollers.

TGV are micro-holes with a diameter of typically 10µm to 100µm. For various applications in the advanced packaging sector, tens of thousands of these vias are deposited per wafer and metallized to produce the required conductivity. TGVs are also used in the manufacture of displays, for example based on µLED. Previous methods for manufacturing were slow, associated with high reject rates and difficult to match to the metallization process.

Game Changing Speed and Precision
Together with Plan Optik AG, 4JET have developed a solution that can prepare several 10,000 vias per minute, which are then etched in a subsequent batch process before being coated. The resulting channels are positioned with a hole-to-hole accuracy better than +/- 2µm, the substrates are free of microcracks, and the insides of the channels are smooth-walled and can be homogeneously metallized. The process is suitable for glass types typical in the semiconductor and display industry. In addition to glass starting thicknesses of 100µm, various copper or Cu/Au layers down to 25µm thickness can be realized.

Next generation selective glass etching
Magnitudes faster than conventional mechanical or laser-based processes based on ablation.
Hole diameter down to  20µm in flexible positioning
Clean process without masking and debris
Available on substrates up to 1500 x 800mm
Combination with the extensive process chain of Plan Optik AG creates the world's leading solution chain for completely processed and metallized TGV wafers.

All spring-loaded test probes measure electrical currents and have a similar operating principle with spring-loaded plunger and recommended working stroke. 

All products from the test probes range are also available via the product finder.
INGUN offers customers an unsurpassed variety of spring-loaded test probes. The individual series differ mainly regarding material, tip style and diameter, spring force and installation conditions. Our test probes are characterized by the high quality of the individual components combined with precision and durability in the application. As a partner for electronics production, we combine expert knowledge with the skill to implement this and a worldwide presence.

The FHR.Star and FHR.Star-EOSS® series are modular cluster systems engineered for thin-film processing on 200 mm wafers. These vacuum platforms integrate a wide range of technologies, including PVD (magnetron sputtering), thermal and e-beam evaporation, ALD/SALD, PECVD, and plasma-based pre-cleaning or etching. Designed for maximum flexibility, process stability, and cleanroom compatibility, they address applications in MEMS, wafer-level packaging, optoelectronics, and heterogeneous integration.

The FHR.Star-EOSS®—developed in cooperation with Fraunhofer IST—features a sputter-up configuration, dual magnetron sources with bipolar pulsing, and broadband optical monitoring for precise optical filter manufacturing.

All systems are fully automated, software-controlled, and scalable from development to high-volume manufacturing. As part of the VITAL Materials Group, FHR also offers process support, target materials, and customized coating solutions.