New Smart Technology Co., Ltd

The trend of semiconductor advanced manufacturing process is to develop the wafer towards multi-layer stacking, so that the size of the wafer is smaller, more power-efficient, and more powerful; therefore, the evolution of 3D stacking technology and heterogeneous packaging technology will drive the development of automatic optical inspection technology towards more precise inspection.

3D packaging has become the focus of TSMC, Intel and Samsung. TSMC is engaged in advanced process wafer-level internal packaging, and the major packaging and testing houses in Taiwan will also focus on system-level packaging (SiP) and integrated antenna package (AiP) for R&D. In addition, various 5G cell phones are expected to use AnyLayer HDI and Substrate-Link PCB (SLP). Due to the huge amount of data to be handled, the focus is on energy and heat dissipation, so the high speed computing products use 2.5D and 3D large integrated package structure to enhance the speed and quality of signal transmission.

Mainly by regrouping class carrier board, silicon carrier board and RDL as a bridge for communication between wafers, the line spacing can be reduced by 4~5 times compared to traditional substrate. The reduction of line width and line spacing can effectively increase the footprint of the package and shorten the signal delay time to improve the overall system performance, and there will be a certain market demand for AOI inspection devices with line width and line diameter smaller than um.

NST 3D Metrology Function performs sample height and coplanarity measurement for C2&C4 Wafer Bumping and 2.5D Wire Bonding process by using 3D High Resolution Optical System to ensure consistent Bump height and stable Bump and Substrate bonding.

Features

• High-speed 3D Full Bump height measurement
• Bump Diameter
• Bump Height
• 3D multi-functional measurement system
• Support high aspect ratio products (AR 1:7) μBump tall pillar 3D measurement
• Easy-to-use visualization of various engineering analyses
• Contour map
• Contour map
• 3D profile
• Auto switching multi-magnification microscopic inspection system
• Nanoscale Auto Focus System
• Large-size chip alignment system (Multi-View)
• Recipe off-line editing function
• Multi-Thread image comparison algorithm system
• Visual measurement system to detect key dimensions by image measurement
• Import CAD to save Recipe creation time
• Automatic calibration and inspection system
• Customized report output
• Fast loading and unloading (<10sec)

Optional

• AI Function
• OCR function
• Review /re- judgment system
• EDC function
• Real-time process status display
• SECS/GEM compatible
• SEMI S2 security certified
• High warpage solution

Critical defect

• Residue
• Particle
• Damage
• Open / Short
• Scratch

OSD-T200 AOI inspection machine uses a high precision optical image inspection system to inspect the surface condition of the material, supplemented by image processing technology, to detect defects such as foreign objects or abnormal patterns on the surface (internal) of the material.

The defective images are then transferred to our Multi-Thread comparative algorithm system and AI analysis system, and fed back to the pre-processing process for full automatic adjustment of the relevant process parameters.

Critical defect

NST AOI Customized Response

This product is a set of AI vision project development system which can help users quickly complete the training and deployment of AI models. Its main modules include training software, inference system and Runtime DLL.

The features are as follows:

1. No code to complete model training which is very convenient and easy to use.

2. Support a variety of vision functions which including classification, defect detection, anomaly detection, etc.

3. Provide a complete model evaluation function, allowing users to quickly evaluate the training effectiveness of the model.

Import benefits:

1. Users can quickly develop high-quality AI models and improve work efficiency.

2. The AI visual inference system provides an API communication protocol, allowing users to easily perform model inference.

3. The AI Vision Runtime DLL can provide integrated sample code, allowing users to integrate AI functions into applications more easily.

NST AIRS can be used to re-judgment the product pictures judged to be defective by the AOI equipment, thereby reducing the overkill rate of the existing AOI equipment. It is an economical and quick-to-implement AI solution. The system supports custom I/O formats which is convenient for docking with various AOIs, and can be imported into existing production lines directly.

Features of AIRS:

1. Support customer-defined I/O formats, easy to integrate into existing production line processes.

2. Automatically select AI recipe function to reduce the manual work of tedious operations.

3. Output the AI re-judgment report to facilitate the management of rejudgment results.

4. Output Wafer Map, visualize AI re-judgment results, and count yield changes.

Import benefits:

1. Reduce the overkill rate: AIRS can re-judgment the products judged to be defective by AOI, avoid the overkill rate caused by over-judgment, and improve the pass rate of the product.

2. Improve judgment accuracy: The AIRS uses artificial intelligence technology for re-judgment which can continuously learn and optimize the judgment model to improve the precision and accuracy of judgment.

MLOps is our company's latest AI technology and this product focuses on applying AI technology to industrial fields, particularly in defect detection, defect recognition, and defect classification in the production process. Here are the main features and advantages of MLOps:

Key Features:

1. AI Model Development and Training:

1. Complete AI model development and training quickly without writing AI programs, using zero-code modeling tools
2. Supports federated learning and multi-model retraining, enhancing the accuracy and adaptability of models.

2. AI Model Management and Deployment:

• Offers cloud and edge deployment options, flexibly adapting to different production environments.
• Batch updates and real-time monitoring of models ensure optimal performance of production line models.

3. AI-Assisted Annotation Tools:

• Intelligent annotation system to improve data annotation efficiency.
• Supports detection of various types of defects, including dirt, cracks, white spots, and external damage.

4. Remote Configuration and Troubleshooting:

• Remote management and configuration tools for group management and troubleshooting of edge devices.
• Real-time event notifications ensure stability and safety in the production process.

Product Advantages:

• Improved Production Efficiency:

Automated defect detection through AI technology significantly reduces the time and cost of manual inspection, enhancing production line efficiency.

• Increased Detection Accuracy:

Precise defect recognition and classification functions reduce false positives and false negatives, improving product quality.

• Flexible Deployment Options:

Supports various deployment options, making it flexible for both small production lines and large factories.

• Reduced Operational Costs:

Minimizes manual intervention and maintenance costs, maintaining high operational efficiency of the AI system through automated model retraining and optimization​​.

1.產品名稱：光電二極體(Photo Diode, PD)​

Photodiodes are sensitive to a specific range of light wavelengths, corresponding materials are selected for sensing depending on the wavelength of the Emitting Device The materials are divided into silicon-based PD (sensing wavelength between 400 ~1100 nm) and compounds PD (sensing wavelength between 480~650nm / 900~1700nm), coupled with coating technology, can achieve sensing effects in specific wavelength to meet the differentiated needs of customers.

2.產品名稱：光電晶體(Phototransistor)

It consists of emitting device, sensing device and signal amplification to complete the switch of electricity-optical-electricity, and the input and output are completely electrically isolated, realizing one-way transmission of input signals and preventing the output signal from affecting the input . It is often used in optical Coupler signal isolation switch and signal transmission.

3.產品名稱：光閘流體(Photo Triac)

(1). 零點觸發 (ZC) :

For 60Hz AC power supply, there are sixty sine wave cycles and sixty crossing points to zero voltage. When turning on or switching off at this moment, it doesn’t quite occur the sparkle in order to extend the life of switch connection node.

If using the light triggering thyristor with much shorter conducting time characteristics as a control switch which drives external connection node at the zero crossing, it is able to surpass those of longer reaction time in conventional electromagnetic relay which is unable to reach in the zero-cross switching.

(2). 非零點觸發 (NZC) :

What differs from ZC is that the NZC allows to output voltage at any time of AC sine wave. Therefore, because the output voltage wave form is not always the competed sine wave so it can control the phase angle to output different power.