Joen Lih Machinery Co., Ltd.

Joen Lih wafer polishing machine has several important features designed to achieve the precise surface finish required in semiconductor manufacturing. Here are some key features:

1. Precision Control: High precision in pressure, speed, and polishing time control to achieve uniform material removal and surface flatness.

2. Multi-Station Design: Multiple polishing stations allow for simultaneous processing of several wafers, increasing throughput.

3. Slurry Delivery System: Precise delivery and control of slurry for consistent polishing quality.

4. Rotating Platen: The platen rotates the wafer against the polishing pad to achieve even material removal.

5. End Point Detection: Advanced sensors and monitoring systems including automatically thickness measurement

Joen Lih Machinery's wafer thinning grinding machines are designed to achieve precise thinning of semiconductor wafers. Here are some of their key features:
1. High Precision Grinding: Equipped with advanced grinding wheels and control systems to achieve ultra-thin wafer (25um AlN without type) profiles with high accuracy.
2. Spindle Design: High-speed Air spindle with excellent stability and minimal runout for consistent grinding performance.

3. Cooling System: Integrated cooling systems to manage heat generated during grinding, preventing wafer damage and ensuring process stability.

4. Vibration Control: Mechanisms to minimize vibrations during grinding, which enhances surface quality and reduces the risk of wafer breakage.

5. Automatic Thickness Control: Sensors and feedback mechanisms to monitor and control wafer thickness in real-time, ensuring uniformity.

6. User-Friendly Interface: Intuitive control panels and software for easy operation, process monitoring, and adjustments.

7. Safety Features: Includes emergency stops, protective enclosures, and safety interlocks to ensure operator safety.

8. Precision Chuck: Advanced chuck designs to securely hold wafers in place during grinding, ensuring minimal movement and high precision.

9. Customization Options: Ability to customize machines to meet specific customer requirements, including different wafer sizes and materials.