Shenzhen Huaxin Intelligent Equipment Co.,Ltd.
深圳,
China
Booth: N1182
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200 Equipment, Assembly
Die Sorter; Pick & Place; Flip Chip Placement Systems
Wafer Level Bonders
205 Equipment, Nanotechnology
Equipment, Nanotechnology Tools
207 Equipment, Process
Wafer Identification; Marking Equipment
309 Materials, Test
Test Sockets; Contactors and Contact accessories
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Appointment Date*
Wednesday, Sep 04 2024
Thursday, Sep 05 2024
Friday, Sep 06 2024
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Wed Sep, 04
Thu Sep, 05
Fri Sep, 06
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