SCHOTT TAIWAN LTD.

Discover the backbone of semiconductor manufacturing with our glass carrier wafers. Precision engineered from premium borosilicate and alumino-borosilicate glass, these wafers provide efficiency and reliability for 3D IC packaging, wafer thinning and fan-out wafer level packaging (FO-WLP). Designed for the safe bonding of semiconductor wafers, our glass carriers ensure seamless handling and protection from damage throughout production.

Each Glass Carrier wafer is a result of state-of-the-art technology and precise processing techniques to the highest quality standards. Their superior thermal expansion behavior and unparalleled light transmission make them indispensable throughout the semiconductor industry, facilitating the manufacture of critical components such as 3D ICs and FO-WLP.

Experience the advantages of glass over conventional materials: combat warpage with a wide range of glasses tailored to different thermal expansions while benefiting from exceptional light transmission and thermal stability. Improve your semiconductor processes with our glass carrier wafers, which represent the pinnacle of reliability and performance.

Introducing the future of chip manufacturing: Glass Core Panels. As pioneers in advancing Moore's Law, we meet the evolving demands of the packaging industry. With a wide material range and ongoing development, we offer customized glass solutions for semiconductors’ packaging. Our glass core panels address challenging trends such as high data transfer efficiency, subsequent increase of unit sizes, and the emergence of new technologies like Optoboards.  

Partner with us for the next generation of semiconductor packaging, where glass is the solution for denser, more efficient chips.

Unveil the potential of our SCHOTT® low-loss, a game-changer in RF applications. With a Dk of 4.0, it fosters broadband antenna solutions, minimizing signal delay for seamless communication. Its low dielectric loss of tan(δ)@10GHz=0.0021 ensures the efficiency of RF designs, propelling advancements in Antenna in Package (AIP) solutions with expansive arrays.

Tailored to the semiconductor components, its CTE matches seamlessly, while its low alkaline content ensures reliability. Available in a wide range of thicknesses, from 127 µm to 1.0 mm and more, it caters to diverse application needs.

Furthermore, its smooth surface, with a roughness of Ra < 5 nm, facilitates RF line design with minimal scattering losses, promising enhanced signal transport. Embrace the future with our glass, as we continue to refine our manufacturing processes for improved material availability in the near future.