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Daicel Corporation

港区,  東京都 
Japan
https://www.daicel.com/smart/en/
  • Booth: L1107

Overview

We aim to be an "problem-solving company" that unearths social needs and provide solutions.

Through providing value which meets the demands of society, Daicel group contributes to improving people's lives.

我們致力於成為一家發掘社會需求並提供解決方案的「解決問題的公司」。

大賽璐集團通過提供滿足社會需求價值,為改善人类生活做出貢獻。


  Press Releases

  • (Jun 28, 2024)

    We provide materials for semiconductor manufacturing, including low-metal solvents such as PGMEA for managing metal content, and polymers for semiconductor photoresists.
    【Semiconductor Manufacturing Materials】
    ・Polymers for FPD Resist: An acrylic polymer used in various electronic components for liquid crystal displays and circuit boards. It boasts excellent heat resistance, solvent resistance, transparency, and storage stability.
    ・Low-Metal Solvents: Essential for semiconductor manufacturing, we introduce high-quality low-metal solvents including PGMEA. With domestic integrated manufacturing, we ensure stable supply of solvent with stable quality.
    ・CELTOL®: CELTOL is mixture of solvents. It developed to improve yield and device performance. It is used in the manufacturing of multilayer ceramic capacitors (MLCCs) and more.
    ・lens: Daicel's wafer-level lenses are manufactured using their proprietary imprint molding process. They offer high design flexibility and excel in forming intricate and complex shapes at the sub-micron level. This enables the production of optical elements with various optical characteristics.
    ・Low temperature Cu Sintering Paste: Cu-Cu bonding is possible at 200 degrees, there is no need to remove Cu oxide, and it can be used for heat sinks, substrates, and die bonding.
    ・Via filling Cu Sintering Paste for Glass Core: It features high aspect ratio via filling, faster via filling than Cu plating, low thermal resistance and low electrical resistance.
    ・Cu Surface Treatment for Hybrid Bonding: Molecular Cu protection technology prevents Cu oxidation, and low temperature Cu bonding technology realizes Cu bonding at 200 degrees.

    我們提供半導體製造所需的材料,包括例如PGMEA等可控金屬含量的低金屬溶劑,以及用於半導體光阻劑的聚合物。
    【半導體製造材料】 
    ・FPD 抗蝕劑聚合物:一種丙烯酸聚合物,用於液晶顯示器和電路板的各種電子元件。它具有優異的耐熱性、耐溶劑性、透明性和儲存穩定性。 
    ・低金屬溶劑:這些溶劑是半導體製造的關鍵材料,我們提供包括PGMEA在內的高品質低金屬溶劑。通過日本國內的一體化生產,可以確保溶劑的供應和品質穩定。
    ・CELTOL®:CELTOL是溶劑的混合物。它的開發是為了提高產量和裝置性能。主要被用於製造多層陶瓷電容器 (MLCC) 等。
    ・鏡頭:大賽璐的晶圓級鏡頭採用其獨有的壓印成型工藝製造。它們具有高度的設計靈活性,並且擅長在亞微米層級形成複雜的形狀。這使其能夠生產具有各種光學特性的光學元件。