三菱ガス化学（株）

Tokyo,  Japan
https://www.mgc.co.jp/
  • Booth: R8129

創造社會共享價值

Overview

三菱瓦斯化學(MGC)集團業務寬泛多樣，包括甲醇、過氧化氫、高性能工程塑料、MXDA·MX 尼龍等化工產品和材料產品，以及電子化學品、光學材料、半導體封裝材料、脫氧劑 「AGELESS™」 等功能產品。

本集團以 「創造社會共享價值」 為使命，旨在創造既有經濟價值又有社會價值的共享價值，實現持續成長。

 

三菱ガス化学(MGC)グループは、メタノール、過酸化水素、高機能エンジニアリングプラスチックス、メタキシレンジアミン(MXDA)・MXナイロンといった化学品・素材製品、さらには発泡プラスチック、電子化学品、光学材料、半導体パッケージ材料、脱酸素剤エージレス® といった機能製品まで、幅広く多様な事業を展開しています。

MGCグループは 「社会と分かち合える価値の創造」 というミッションのもと、経済的価値のみならず、社会的価値もある共通価値を創造し、継続的な成長の実現を目指していきます。

  Products

  • Stock shape of polyimide for test socket TZ3300
    TZ3300 is a ceramic reinforced PI material, stock shape for IC inspection jigs with fine machining and dimensional stability at high temperatures....

    • Ceramic reinfoced PI material
    TZ3300 is a ceramic reinforced PI material, stockshape for IC inspection jigs with fine machining and dimensional stability at hihg temperatures.

    【Characteristic】
    ■Fine machining of 100μm or less is possible.
    ■Very low burring
    ■Excellent dimensional stability by high heat resistant PI
    ■Excellent machinability and can be processed into various shapes
    ■Low water absorpption in spite of PI-based material

    【Applications】
    ■Test socket
    ■IC inspection jigs
  • Thermoplastic polyimide for 5G highspeed
    good dielectric properties and is resistant to high temperatures
    Material for high-speed communication equipment
    ...

    • good dielectric properties and is resistant to high temperatures
    Material for high-speed communication equipment

    【Characteristic】
    ■Good dielectric properties in a wide frequency band including the millimeter wave region.
    ■High heat-resistance(Tm323°C/Tg185°C)、V-2 Level
    ■Good solvent-resistance (Insoluble in solvent).
    ■25Can mold from 25μm thin film to 100mmt large parts.
    ➡Suitable for antenna boards, base station parts, etc.

    【Application example】
    ■Low Dielectric FPC
    ■CCL (Copper-clad laminate)

產品種類

208 Equipment, Test
  • ESD; EMS and Latch-up Systems
  • Functional Test Systems
  • Memory Test Systems
  • Package Test Systems
  • Printed Circuit Board; Wire Board (PCB or PWB) Test and Repair
    • 300 Materials, Assembly
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
  • Package Substrates; Laminate; Film based
    • 308 Materials, Substrate
  • Substrate Materials
    • 309 Materials, Test
  • Burn-In Boards; Performance Boards (incl. Low; High Temp and Ceramic)
  • Probe Cards; DUT boards and other probing accessories (incl Ceramic and Special Purpose Probe Cards)
  • Test Sockets; Contactors and Contact accessories
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