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Maxell Taiwan Ltd

Taipei City,  Taiwan
http://www.maxell.com.tw
  • Booth: M0854

Within, the Future

Overview

Maxell Group aims to enchance both social and economic value, by solving customer's issues through our unique Analog Core Tecnologies of ''Mixing & Dipersion'', ''Fine Coating'' and ''High Precision Molding & Forming'' cultivated since its foundation, and by earning customer's recognition that we are ''indispensable''.

In the world of manufacturing, which demands further miniaturization, refinement, and higher density, we continue to hone our Analog Core Technologies to remain a company that solves our customer's issues.

Maxell group products by Business Segment. 

  Energy                     : Batteries, All-solid-state batteries, etc.

  Functional materials : Adhesive tapes, Films, Inks, etc.

  Optics & Systems     : Electroforming, Lens unit, etc.

  Life Solution             : Health equipment, Beauty household appliances, etc.

  Products

  • Dicing Tape
    Special adhesive is used to achive high adhesion and easy peeling....

    • Maxell dicing tape is a UV type DC tape that can be used in the dicing process of various wafers and packages. It has a high fixing force during dicing and exhibits excellent pickup performance by irradiating with UV.

    A special polyolefin resin is used for the backing, and it is possible to impart properties suitable for the customer's process and request, such as excellent expandability, burr reduction, and antistatic properties. In addition, by using a special UV adhesive as the adhesive, the contamination of the chip is reduced.

  • Back Grinding Tape
    Exellent conformity to bumped wafers of a large diameter...

    • This is back grinding tape for wafers with irregularities exceeding 200µm in height. By using a special adhesive, it shows good conformity to bump and prevents from wafer damage and dimples. We have a lineup for two types, pressure sensitive and UV peeling type.

  • TLEM
    Transcription Lead of Electroforming Method
    The electroforming lead frame which enables to make small and thin IC packages....

    • Possible to make IC package small/thin.

    Upper part of the lead frame is overhanging shape(Anti-falling off).

    Provide excellent wire-bonding performance because of metal substrate.

    By no metal-cut necessary, dicing speed up, low wear of blade and high integration of package.

  • Special Double-Layer stencil
    Special stencil which enables free control of ink delivery....

    • Possible to locate rib optimally by double-layers electroforming structure. Improved paste filling by enlarging the opening of the rib part from the aperture.

Categories

200 Equipment, Assembly
  • Ball Placement; Attach Systems
    • 300 Materials, Assembly
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
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