Overview
BTU is the global leader in thermal process equipment used for the production of electronics and electronic components. Typically these applications require high productivity and excellent process control. BTU’s Pyramax family of convection reflow ovens are used for printed circuit board assembly, semiconductor packaging, and LED assembly among other applications. Especially in the semiconductor packaging industry, BTU’s mass reflow oven applies to advanced package well, such as BGA ball mount, Wafer bumping, Flip-Chip, FC-BGA, FOPLP, etc.…
PYRAMAX™ convection reflow oven is the benchmark for performance in the industry. The PYRAMAX features a maximum temperature of 400°C and a comprehensive menu of options. PYRAMAX systems, featuring BTU’s exclusive closed-loop convection technology, provide optimized lead-free processing for the ultimate in productivity and efficiency.
The new TrueFlat technology is an option for the PYRAMAX™ reflow oven. TrueFlat technology is specially designed for substrates with a thickness between 0.15mm to 0.30mm. The soldering issue caused by die tilt can be solved effectively by flattening the substrate during the reflow process.
BTU's Aurora platform, the latest mass reflow oven provides extreme flexibility for different applications with the longest heating zone. From the highest productivity to the lowest ramp-up and cooling rate, the Aurora platform fits all the requirements.