Daicel Corporation

港区,  東京都 
Japan
https://www.daicel.com/smart/en/
  • Booth: L1107

Overview

We aim to be an "problem-solving company" that unearths social needs and provide solutions.

Through providing value which meets the demands of society, Daicel group contributes to improving people's lives.

我們致力於成為一家發掘社會需求並提供解決方案的「解決問題的公司」。

大賽璐集團通過提供滿足社會需求價值,為改善人类生活做出貢獻。


  Press Releases

  • (Jun 28, 2024)
    We provide materials for semiconductor manufacturing, including low-metal solvents such as PGMEA for managing metal content, and polymers for semiconductor photoresists.
    【Semiconductor Manufacturing Materials】
    Polymers for FPD Resist: An acrylic polymer used in various electronic components for liquid crystal displays and circuit boards. It boasts excellent heat resistance, solvent resistance, transparency, and storage stability.
    Low-Metal Solvents: Essential for semiconductor manufacturing, we introduce high-quality low-metal solvents including PGMEA. With domestic integrated manufacturing, we ensure stable supply of solvent with stable quality.
    CELTOL®: CELTOL is mixture of solvents. It developed to improve yield and device performance. It is used in the manufacturing of multilayer ceramic capacitors (MLCCs) and more.
    lens: Daicel's wafer-level lenses are manufactured using their proprietary imprint molding process. They offer high design flexibility and excel in forming intricate and complex shapes at the sub-micron level. This enables the production of optical elements with various optical characteristics.
    Polymer hybrid bonding material: It is a bonding material that exhibits a high process margin against particle defects and enables low-temperature bonding.
    Non-shrinking high-heat-resistant resin: As the name suggests, this resin does not shrink upon curing and can withstand high-temperature processes. It meets the requirements of advanced packaging (3D packaging). It is also suitable for encapsulation resins, FOWLP/FOPLP, die stacking, and other applications.
    Copper sintering material: Copper sintering paste applicable to fine bump joining for 3D packaging, via joining for printed circuit boards, and component joining within embedded printed circuit boards. It allows low-temperature bonding of 200-250°C.
    我們提供半導體製造所需的材料,包括例如PGMEA等可控金屬含量的低金屬溶劑,以及用於半導體光阻劑的聚合物。
    【半導體製造材料】
    FPD 抗蝕劑聚合物:一種丙烯酸聚合物,用於液晶顯示器和電路板的各種電子元件。它具有優異的耐熱性、耐溶劑性、透明性和儲存穩定性。
    低金屬溶劑:這些溶劑是半導體製造的關鍵材料,我們提供包括PGMEA在內的高品質低金屬溶劑。通過日本國內的一體化生產,可以確保溶劑的供應和品質穩定。
    CELTOL®:CELTOL是溶劑的混合物。它的開發是為了提高產量和裝置性能。主要被用於製造多層陶瓷電容器 (MLCC) 等。
    鏡頭:大賽璐的晶圓級鏡頭採用其獨有的壓印成型工藝製造。它們具有高度的設計靈活性,並且擅長在亞微米層級形成複雜的形狀。這使其能夠生產具有各種光學特性的光學元件。
    聚合物混合鍵合材料:這是一種鍵合材料,對顆粒缺陷具有高工藝餘裕,並且能實現低溫鍵合。
    無收縮高耐熱樹脂:顧名思義,這種樹脂固化後不收縮且可以承受高溫工藝。滿足先進封裝(3D封裝)的要求。它也適用於封裝樹脂、FOWLP/FOPLP、晶片疊層和其他應用。
    銅燒結材料:銅燒結漿料適用於3D封裝中的微細凸點連接,印刷電路板的通孔連接,以及嵌入式印刷電路板內的元件連接。它能實現200-250°C的低溫鍵合。