Dean Tech Co., Ltd

新北市,  Taiwan
  • Booth: S7537

Overview

  Products

  • SIO MIXER 超微細氣泡產生裝置
    無須通入任何外部氣體，僅需簡易的安裝上SIO Mixer，即可輕鬆改變液體的特性，改善製程，進而節省成本...

    • 蒸發器通入任何外部氣體，直接簡單地安裝在SIO Mixer上，即可輕鬆改變設備的特性，改善製造流程，進一步節省成本。

Categories

101 Photovoltaic Device Manufacturing
  • PV: Modules
  • PV: Stand-Alone Systems
  • PV-Building-Integrated Solutions
    • 200 Equipment, Assembly
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Cut & Down Set; Trim; Form Equipment
  • Dicing; Sawing; Scribing; Separation Equipment
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Solder Reflow; Soldering & Brazing Equipment
  • Wafer Level Bonders
  • Wafer Mount; Taping Equipment
    • 202 Equipment, General Use
  • Cutting; Drilling; Laser ablation; Beveling Equipment
    • 203 Equipment, Inspection & Measurement
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Microscopes: Atomic Force Microscopes (AFM)
  • Microscopes: Confocal Scanning Microscope; 3-D Video Microscopes
  • Microscopes: Optical Microscopes
  • Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr
  • Overlay Measurement
  • Package Inspection; Lead Scanners
  • Particle Monitors; Analyzers - Airborne or Liquid
  • Plate Inspection Equipment
  • Spectrometers; Fourier Transform Infrared (FTIR); Attenuated Total Reflectance FTIR (ATR-FTIR); Auge
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
  • Wire Bonding Inspection; Test
  • X-ray; XRF; 3-D X-Ray; LEXES Systems
    • 206 PV Equipment
  • Inspection and Metrology
  • Modules
  • Thin Film
  • Wafers
    • 207 Equipment, Process
  • Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Coat; Develop; Resist Processing; Track Equipment
  • Crystal Growing & Machining Equipment
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Environmental Enclosures; Minienvironments
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
  • Plating; Electro Chemical Plating; Deposition Systems
  • Wafer Identification; Marking Equipment
    • 300 Materials, Assembly
  • Thick Film Pastes; Materials
  • Thin Film; Dielectric Film Materials
    • 301 Materials, Chemicals & Solids
  • Cleaning Chemicals; Solvents; Strippers
  • DI; UP Water
  • Other Specialty Chemicals
    • 307 Materials, Process
  • CMP; Grind; Lap; Polish; Abrasive materials
    • 401 Sub-systems
  • Ultrasonic Generators; Transducer and Monitoring Systems
    • 402 PV Systems
  • Measurement and Control Technology
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