Evatec AG

Trübbach,  Switzerland
  • Booth: M0834

Welcome to Evatec- The Thin Film Powerhouse


Evatec is your partner delivering thin film production solutions for Advanced Packaging, Semiconductor, Optoelectronics and Photonics.  We offer a range of batch, cluster and inline deposition systems according to customer throughput, process requirements and fab integration requirements.  Evatec's innovative source designs combined with Advanced Control (APC) technologies set new standards in process control through "in situ" capability for control of film properties during the deposition cycle.

Visit the Evatec booth this year to hear all the latest updates in thin film production solutions :

  • With more process capability, more flexibility and more throughput the new generation of HEXAGON simply gives you MORE .  Learn how the new HEXAGON is the perfect choice for fan-out wafer level packaging (FOWLP) and Wafer Level Chip Scale (WLCSP) applications
  • See how Evatec thin film solutions on SiC and GaN are helping customers "power ahead" in Wide Bang Gap power applications 
  • Hear how our thin film solutions for precision optical layers are enabling manufacturing costs to be driven down for  Augmented Reality, Edge Emitting Lasers (EELs) and MicroLED
  • Learn how Evatec thin film production solutions for Through Glass Via (TGV) for Advanced IC substrate applications enable seed layer deposition with excellent adhesion at both wafer and panel level

The Evatec team look forward to welcomg you to our booth.