Indium Corporation

Singapore,  Singapore
http://www.indium.com
  • Booth: L0330

Indium Corporation's advanced materials for semiconductors!

Overview

Since the company’s founding in 1934, Indium Corporation® has been driven by its curiosity to look at materials from a different perspective – transforming the ordinary into the unexpected.


Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil® . Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.


For more information about Indium Corporation, visit www.indium.com or email [email protected].. You can also follow our experts, From One Engineer To Another® (#FOETA), at https://www.linkedin.com/company/indium-corporation/. 


  Products

  • Indalloy® 301LT
    Indalloy®301 LT is a patented novel alloy that enables lower processing temperatures in preform soldering. This bismuth-free alloy enables low-temperature processing without sacrificing reliability....

  • Power electronics applications are becoming increasingly high in demand, particularly in fields such as the integration of power module-cooler in electric vehicles (EVs). Providing better thermal and mechanical performance than conventional thermal interface materials, Indalloy®301 LT rises to the occasion. Indalloy®301 LT is a patented novel alloy that enables lower processing temperatures in preform soldering. This bismuth-free alloy enables low-temperature processing without sacrificing reliability. By leveraging this alloy technology in solder preform applications, designers can maintain precise solder volume, consistent manufacturability, and high-quality flux-free soldering performance. Further, Indalloy®301 LT availability in InFORMS® configurations offers a complementary solution for consistent bondline thickness and improved strength to enhance thermal and mechanical reliability of the solder joint while reducing processing temperature and energy input during manufacturing. 
  • WS-446

    Flip Chip Flux WS-446 is a water-soluble flip-chip dipping flux, and a perfect solution for advanced semiconductor assembly....

  • This water-soluble flip-chip dipping flux features a potent activator system that ensures exceptional wetting on even the most challenging substrate metallizations. Its distinctive red color not only aids automated level-sensing equipment but also enhances visual inspection for precision and efficiency in production environments. WS-446 is intended to be used in a nitrogen reflow environment of 50ppm oxygen or less. WS-446 can be used on many surface finishes including immersion Ag, Cu, and Ni. These surfaces can be soldered with Sn/Pb or Pb-free alloys.

    Key features include:

    • Designed for flip-chip dipping applications

    • Tackiness suitable for holding large die during assembly

    • Bubble-free packaging

    • Red color for ease of detection

  • NC-809
    NC-809 Flux is a halogen-free, no-clean, ultra-low residue flip-chip flux, which is designed to leave minimal residue while maintaining proper wetting and exhibiting high tackiness....

  • This halogen-free, no-clean flux is carefully formulated to leave ultra-low residue, ensuring exceptional underfill adhesion and reduced void formation during the curing process. Engineered with high tackiness, NC-809 Flux facilitates optimal wetting for enhanced performance in flip-chip dipping and specific wafer-level BGA ball-mount applications. NC-809 Flux meets stringent manufacturing demands with outstanding residue control and precise wetting capabilities.

    NC-809 Flux is a robust flux suitable for many semiconductor assembly applications. The material’s tackiness makes it suitable for flip-chip dipping applications; NC-809 Flux is proven to solve common die shift and die skew issues during flip-chip assembly.

  • Heat-Spring®
    Heat-Spring®, soft metal alloy thermal interface materials (SMA-TIMs), is a patterned, pliable metal foil that is designed to be used as a thermal conduit between two compressed surfaces....

  • Unlock the power of superior thermal management with Heat-Spring®, a cutting-edge soft metal alloy thermal interface material (SMA-TIM) designed to excel in high-performance applications. Crafted as a patterned, pliable metal foil, Heat-Spring® serves as a reliable thermal conduit between compressed surfaces, optimizing heat transfer efficiency. Ideal for a variety of critical applications including TIM2, TIM3, TIM1.5, burn-in tests, and immersion cooling, Heat-Spring® ensures exceptional performance across diverse assembly configurations.

    Common package assemblies include:

    • Bare die to heat-sink (mobile ICs and GPUs)

    • Heat spreader to spreader

    • Heat spreader to heat-sink

    • Heat spreader board to heat-sink (LEDs)

    • Base plate to liquid cold plate (IGBTs)

    • Power amplifier to spreader and spreader to plate (power assemblies)

    • Spreader to cooling solution

    • Test modules (burn-in)

  • Liquid Metal Paste
    LMP is a next generation liquid metal-based thermal paste designed specifically for thermal management of HPC semiconductor applications, such as CPU, GPU, and MCM....

  • Our cutting-edge liquid metal-based thermal paste redefines the thermal management in HPC semiconductor applications. Engineered specifically for use with CPUs, GPUs, and MCMs, LMP harnesses the power of gallium-based liquid metals while incorporating proprietary enhancements. This includes a customized viscosity through unique processes and additives, transforming it into a homogeneous thermal paste that is both dispensable and jettable. Ideal for high-volume applications, LMP ensures optimal heat dissipation and reliability, meeting the rigorous demands of modern computing environments.

     Features include:

    • No flux, metallization, or reflow required

    • Easy application via dispensing/jetting

    • Achievable thermal resistance of 0.03Kº/W

    • Improved rheology for better application and stability against leakage

    • Achievable BLT as low as 25μm

    • Should not be used with aluminum

  • Liquid Metal
    Several low-melting point Indalloy® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury....

  • Several of our Indalloy® alloys are engineered to remain liquid at room temperature. These gallium-based alloys serve as safe, non-toxic alternatives to mercury, offering superior environmental and sustainability benefits. With significantly lower vapor pressure compared to mercury, they minimize metal vapor exposure, effectively reducing both its quantity and toxicity. Ideal for a wide range of applications, these alloys are suitable for thermostats, switches, barometers, heat transfer systems, thermal cooling and heating designs, and TIM2 interfaces.