KINGSEMI CO., LTD
Shenyang City, Liaoning Province,
China
http://www.kingsemi.com
Booth: N0462
Overview
KINGSEMI Co., Ltd. was established in 2002, which is a national high-tech enterprise created by CAS Shenyang Institute of Automation Chinese Academy of Sciences, specializing in the development, production, sales and service of semiconductor production equipment, committed to providing customers with semiconductor process equipment Overall solution.
KINGSEMI is located in Shenyang Hunnan High-tech Industrial Development Zone, with high-grade purification plant and first-class R & D office environment; has passed the ISO9001/ISO14001/OHSAS18001/SEMI-S2 for semiconductor manufacturing equipment. We has conducted absorption, innovation and improvement based on the imported technology, which has obtained the formation of independent intellectual property rights system with 240 patents, including 196 inventive patents. The spin coater and developer of KINGSEMI is the first class in domestic developing field of technology and advanced level international. We has developed coater, developer, spray coater, scrubber, wet etching, cleaner, stripper products, has formed a complete system and extensive product range, and tailored according to the user process requirements. Our products are widely used in semiconductor manufacturing, advanced packaging, MEMS, LED, OLED, 3D-IC TSV, PV and other fields meeting the process technology of 300mm front and 300mm advanced packaging process thick rubber.
KINGSEMI has established a rapid responsible team of sales and technical services beside the customers. We undertake national major science and technology project of " Manufacturing Equipment and Complete Process for Integrated Circuit of Large Scale ", advanced and reliable products and quality services to win customers’ trust, become a high-end semiconductor equipment and process solutions company with international competitiveness relying on the support of national major projects, KINGSEMI will accelerate innovation and enhance ability to complete sets of products.
Categories
200 Equipment, Assembly
Cleaning; Washing Equipment for Assembly & Packaging
Device Handling; Feeding Systems
Dispensing Systems
Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
207 Equipment, Process
Bumping Systems
Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
Coat; Develop; Resist Processing; Track Equipment
Etching; Stripping; Ashing - Dry and Wet Equipment
Spin on Glass (SOG); on Dielectric (SOD) Track systems
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Appointment Date*
Wednesday, Sep 04 2024
Thursday, Sep 05 2024
Friday, Sep 06 2024
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Wed Sep, 04
Thu Sep, 05
Fri Sep, 06
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