Overview
Established in 2007, Bay Photonics harnesses the power of light through its expertise in designing, packaging, assembling and testing cutting-edge semiconductor-based photonic devices.
With a highly skilled workforce and state-of-the-art, fully automatic workstations, the company excels in operating semi-manual workstations tailored for small batch sizes whilst supporting large volume commercial packaging houses, facilitating design optimisation for mass production and is the perfect partner for individuals or organisations ranging from TRL3 (proving feasibility/technology development) to TRL7 (demonstrating system prototypes in operational environments).
Bay Photonics’ cutting-edge technologies encompass the gamut of downstream semiconductor device processes and offers comprehensive support for die-singulation, die-attachment, wire-bonding, encapsulation (ensuring mechanical protection, electrical insulation, photonic connection and thermal control for the encapsulated die), final testing and assembly (integration of photonic integrated circuits into products such as sensors, transmitters and receivers).
The company has been driving the quantum technology and AI revolution and has developed expertise in quantum photonics packaging, which entails intricate integration and packaging of photonic devices that generate and manipulate single photons, quantum states of light and quantum information.
Seeking partners for the development of:
• New photonic packaging technologies (e.g. glass & ceramic packaging)
• Fibre array, single photon emitters
• Single photon detectors for quantum applications
• Photonic integrated circuits (PICs)
• Silicon photonics
Bay Photonics創立於2007年，憑藉其在設計、封裝、組裝和測試尖端半導體光子裝置方面的專業能力，駕馭光的力量。
該公司擁有具備高技能的工作團隊和最先進的全自動工作站，擅長經營針對小批次量身打造的半手動工作站，同時也為大量商業封裝廠提供支援，協助大規模量產的設計優化，對於技術完備度第 3級（TRL3，證明可行性／技術開發）到第7級（TRL7，在操作環境中演示系統原型）的個人或組織來說，是完美的合作夥伴。
Bay Photonic的尖端技術涵蓋下游半導體元件製程的所有領域， 並為裸晶切割、黏晶、打線接合、封裝（確保封膠後的裸晶處於機械保護、電氣絕緣、光子連接和熱控制的狀態下）、最終測試和組裝（ 將光子積體電路整合到感測器、發射器和接收器等產品中），提供全面支援。
該公司持續推動量子科技和人工智慧(AI)革命，並致力開發量子子封裝方面的專業知識，這涉及對生成與操縱單光子、光量子態和量子資訊的光子裝置，進行錯綜複雜的整合和封裝。
Bay Photonics有興趣從事以下開發：
• 新的光子封裝技術（例如玻璃和陶瓷封裝等）
• 光纖陣列、單光子發射器
• 用於量子應用的單光子偵測器
• 光子積體電路（PIC）
• 矽光子學