SUMMIT-TECH RESOURCE CORP.

Zhubei City,  Hsinchu County 
Taiwan
https://www.summit-tech.com.tw/
  • Booth: K3389

Overview

Summit-Tech Resource Corp. 
Founded in 1996, Summit-Tech Resource Corp. is headquartered in Linkou District, New Taipei City, Taiwan. We are an international enterprise specializing in the research, development, and manufacturing of high-tech materials. Guided by our core values of "Quality, Innovation, and Sustainability," we are dedicated to providing high-quality sputtering targets and related solutions to global clients across industries such as semiconductors, displays, solar energy, and other high-tech sectors.
Summit-Tech excels in the development and production of pure metal and alloy sputtering targets, including silicon-based materials, graphene, and other advanced materials. Certified under ISO 9001:2015, our stringent quality management system ensures industry-leading performance and reliability. Equipped with advanced electrochemical etching technology and precision manufacturing facilities, we offer customized solutions tailored to diverse client needs.

  Products

  • Sputtering target 濺鍍靶材
    Summit-Tech provides a wide range of sputtering targets, regardless of materials or sizes can all be customized.
    Various kinds of materials including, pure metal, alloys / compounds, Oxides, Nitrides, Fluorides, Selenides, Silicide, Sulphide ...etc.
    ...

    • Rotatable for DC/Pulse & DC/MF use
    • Custom Cylindrical targets 
    • Arc sputtering direct cooling target 
    • Circular (mono block or with B/P)
    • Planar (construction tiles or steps)

  • Evaporation source 蒸鍍源, 乘載舟 及其他製程用料
    Materials which used in Thermal/E-beam Evaporation....

    • Thermal/E-beam evaporation materials

    Granule, Slug, Pellet, Discs

    Cones which fit E-beam liner

    Cr thermal spray on W filament for Cr thermal deposition

    • Metal Wire, normally for Al, Au, Pt… auto feeding
    • Source holder 

    E-beam crucible materials: W, Mo, Graphite(POCO), BN-TiB2(-B2O3)

    Thermal boat materials: W, Mo, Ta, BN-TiB2(-B2O3)

    Thermal crucible materials: QZ, Al2O3, BN, PBN

    Thermal filament materials: W

    • Film-thickness sensor crystal 

    Au, Ag, Ag alloy electrode materials

    • MBE or Epitaxy High Pure Materials
    • Spin coating or spray Materials

    Photo Resist materials

    Sol-gel liquid materials

    UV photolithography Lamps /Housing /Aligner

  • Single crystal wafer 單晶晶圓片
    From 2 inch to 12 inch, we supply different sizes of single crystal wafers.
    Furthermore, customized services including coating service, wafer thinning, wafer slicing/dicing, and TGV process are also available....

    • Silicon wafer
    • SOI wafer
    • Silicon Carbide (SiC) wafer
    • Sapphire(Al2O3) wafer
    • III-V Semiconductors wafer

    GaAs, GaN, GaP, InP, GaAs, InAs, InSb, InP wafer

    • Other single crystal wafer

    LiNbO3, LiTaO3, MgO, MgAl2O4, Quartz, SrTiO3, TiO2(Rutile), ZnS, YAG, YSZ ...,etc.

  • Ceramic substrate 陶瓷基板
    Substrates such as glass wafers, fused silica, AlN, Al2O3, SiC which are used in multiple fields.

    ...

    • Applications: 

    • 5G wireless systems
    • LED packaging
    • Power module (IGBT)
    • Infrared detection
    • Spectral analysis
    • Laser systems
  • Ring for Etching / CVD process
    Rings and components for Etching & CVD process...

    • Silicon ring

    Focus/Edge/Shadow/Guard ring


    Ring/Parts/Component Materials
    -Si, SiO2, Al2O3, Si3N4, SiC, BN … 
    -Special Ceramic: Sapphire, Y2O3, SiC, PBN 

  • Thermal management component
    Hermetic Sealing Materials...

    • Sealing Body (Enclosure/Lid) Materials

    -Metal body: Kovar, Invar 36/42/45, Ti, SUS

    -Lids incl. tapped, flat, window, lead frame, shield…

    -Etching and electroplating, electro less Ni plating

    Getter and Absorbers

    -For Moisture,CO2,orhanic,multi contaminant …

    -Tablet printed precision lid assemblies

    Sealant Materials in sphere/wire/ribbon/preform/foil

    -Glass Frit: PbO-B2O3, ZnO-B2O3 …, powder or spacer

    -Solder alloy: AuSn, AuGe, AuIn, AuSi, SnAg …

    -Active Braze alloy: TiZrCuNi, AgCuSnTi … 

    Thermal Management Materials

    -Heat sinks, Heat spreaders, carriers, bases, pedestals

    -CuMoCu laminate, MoCu, WCu, Cu, Al & alloy, CuAl clad

Categories

300 Materials, Assembly
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
  • Lead Frames & Headers: Etched; Stamped
  • Package Substrates; Laminate; Film based
  • Packages; Ceramic and Other High Temp Compounds
  • Preforms; Lids
  • Scribe Tools; Saw or Dicing Blades and Accessories
  • Solder; Solder Balls and other Soldering Materials
  • Tape Automated Bonding (TAB) Accessories
  • Thermal Interface Materials; Heat Sinks
  • Thick Film Pastes; Materials
  • Thin Film; Dielectric Film Materials
    • 301 Materials, Chemicals & Solids
  • Cleaning Chemicals; Solvents; Strippers
    • 302 Materials, FPD
  • Glass Plates for FPD
    • 305 Materials, Nanotechnology
  • Materials, Nanotechnology
    • 306 PV Materials
  • Gases & Liquid Chemicals
  • Ingots, Wafers
  • Solar Glass, encapsulation
    • 307 Materials, Process
  • Deposition Supplies
  • Deposition/Target Materials
  • Ingots
  • Plasma; Ion Sources
  • Plating Materials
  • Polysilicon or granular polycrystalline silicon; Crystal growing Material
  • Process Chamber Components; Graphite; Carbon Fiber Carbon (CFC); Pyrolytic Boron Nitride (PBN)
  • Quartz ware (Silicon Carbide, Fused Quartz Glass, Sapphire), Ceramic & Oxide Ceramic Fixtures
    • 308 Materials, Substrate
  • Compound Semiconductor substrates (GaAs on Silicon; GaN; InP; SiGe, etc.)
  • Diamond substrates
  • Epitaxial; Epi; Gettered; Internal Gettered Wafers
  • Gallium Arsenide (GaAs); Sapphire Substrates
  • Prime; Polished; Mirrored Wafers
  • Silicon on Insulator (SOI); Silicon on Sapphire (SOS); Silicon Carbide;
  • solar cell substrates; crystalline silicon (c-Si); thin film
  • Strained silicon; Engineered Substrates
  • Substrate Materials
  • Test; Monitor Wafers; Reclaim or Virgin
  • Thin & Thick film substrates for MEMS
    • 400 Components, Parts & Accessories
  • Chucks for Wafer and other Substrates
  • Lamps (non Lithography), all type UV; LED and other
  • Lamps for Lithography
    • 700 Manufacturing Services
  • Deposition Service
  • Etch; Strip; Cleaning Service
  • Ion Implant Service
  • Lithography; Patterning service
  • Measurement; Inspection Service
  • Plating; Electro Polishing; Coating; Surface Treatment
  • Sawing; Lapping; Grinding; Polishing Service
    • 701 Manufacturing Services or Consulting
  • Wafer Handling
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