SUSS MicroTec (Taiwan) Co., Ltd.

MaskTrack Pro offers a unique combination of physical and chemical cleaning technologies and methods for surface preparation and passivation that enable customers to effectively remove particles, organic and inorganic contamination while preserving mask integrity down to 1x angstrom technology node. MaskTrack Pro is backward compatible to 28 nm hp.

Wet Cleaning

Physical-based Cleaning

Offering multiple physical force technologies for wet cleaning the system consists of up to three pre-clean and final-clean chambers for segregation of strip, pre-clean and final clean processes.

• Unique in-situ UV surface preparation and cleaning technology

• High frequency dual megasonic cleaning up to 5MHz

• Precision nano binary spray

• Focus Spot Cleaning

Chemical-based Cleaning

• DIW-H20 degassing for cavitation control during megasonic process

• Ultra-clean hot and cold CO2-DI water

• Ozonated DI water and electrolyzed H2 incl. pH stabilization

• Ultra-diluted SC1

• New alkaline-based media for further pattern damage reduction

• 5 nm process media filtration

Surface Treatment

Sophisticated Preparation, Preservation and Restoration

• High temperature dehydration and ion removal for 193i photomasks

• 172nm UV exposure

• Ambient Plasma surface conditioner

• Environmentally controlled mask storage

Process Automation

Intelligent Solutions

• Wet substrate transfer between pre-clean and final clean process

• Dry flip functionality

• Low contact dual substrate transfer handling

• Multiple input/output and substrate buffer stations

• Online process monitoring via webcam

Standards

In Line with the Industry

• SEMI S2, S8, S13 compliant

• CE marked

• Conform to European harmonized standards and machine directive 2006/42/EC, EMC directive 2004/108/EC and low voltage directive 2006/95/EC

• DIN ISO 14.644 class 2 controlled environment

• Ready for factory automation via SECS/GEM 200/300 mm standard interface

ACS300 Gen2 Coater & Developer

Production Spin Coat / Develop Cluster for Wafer Level Packaging

The ACS300 Gen2 is a modular cluster system designed to meet manufacturers' needs for clean, reliable, high-throughput and modular photolithography processing for 200 and 300mm wafers. Both wafer sizes can be processed parallel or sequential without any mechanical changeover. SUSS MicroTec ACS300 Gen2 systems can be equipped with process modules for HMDS vapor priming, spin coating, spray coating, aqueous or solvent based developing, baking and cooling. It masters thin and thick resist applications as well as photosensitive polymers like polyimide, PBO and Cyclotene (BCB). SUSS MicroTec ACS300 Gen2 addresses all requirements for sophisticated resist processing and the 3D-Integration and Wafer Level Packaging technology in particular.

ACS300 Gen3 Coater & Developer

Powerful Solution for Advanced Packaging Applications

The modular system of ACS300 Gen3 is specifically designed for demanding high-volume production environments. It provides sophisticated coating, developing and baking functionalities that can be easily adapted to various processes. Maximum process control effectively supports the wide field of use. This, together with the smallest footprint on the market for a system with eight spinner modules, all qualities positively affecting cost-of-ownership, make the tool indispensable for any challenging advanced packaging application such as wafer-level chip-scale packaging, fan-out wafer-level packaging, copper pillar flip-chip packaging and 3D packaging.

ACS200 Gen3 Coater & Developer

Combining Expertise with Innovation

The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM. The enhanced version of the platform, ACS200 Gen3 TE, increases flexibility even further with up to 6 spinner and spray modules and an integrated inkjet module.

ACS200 Gen3 TE Coater & Developer

Fully automated platform for maximum throughput

The SUSS ACS200 Gen3 TE platform takes the very successful and well-known ACS200 Gen3 platform to a new level. It increases throughput and makes operation and maintenance more comfortable. The SUSS ACS200 Gen3 TE offers unmatched configuration flexibility of modules and technologies, thus covering the requirements of Advanced Packaging, MEMS, LED, and other markets and serving R&D as well as HVM.

DSC300 Gen3 - PROJECTION LITHOGRAPHY SCANNER FOR AP, WLP, 2.5D & 3D PACKAGING, BUMPING AND FAN-OUT APPLICATIONS

SUSS MicroTec introduces its next generation projection scanner – the DSC300 Gen3. This proprietary scanning lithography platform touts triple digit throughput with fine (2 μm) resolution capabilities at the lowest cost of ownership (CoO) among 1X projection lithography systems.

MA/BA Gen4 Series - COMPACT MASK ALIGNER PLATFORM FOR RESEARCH AND LOW-VOLUME PRODUCTION

The MA/BA Gen4 series represents the latest generation of SUSS MicroTec’s semi-automated Mask and Bond Aligner introducing a new platform system. There are two platform types that differ in configuration. The MA/BA Gen4 is suited for standard processes and the MA/BA Gen4 Pro Series is designed for advanced and high-end processes.

MA12 Gen3 - SUSS IMPRINT LITHOGRAPHY EQUIPMENT

For the transfer of patterns in the micro- to nanometer range, SUSS MicroTec offers SMILE (SUSS MicroTec Imprint Lithography Equipment) technology. The SMILE process allows very precise imprint of both micro- and nano-patterns, thereby offering a wide spectrum of potential applications and thus excellent process flexibility. For example, SMILE is used in the production of many booming applications such as augmented reality, automotive applications and much more.

XBC300 Gen2 D2W/W2W

World’s first hybrid bonding allrounder for 200 mm and 300 mm substrates

The new XBC300 Gen2 D2W/W2W cluster is the only platform in the world to integrate all existing hybrid bonding processes in a single tool: W2W, collective D2W and sequential D2W. The XBC300 Gen2 D2W/W2W is the result of a cooperation between SUSS and SET Corporation SA, a leading supplier of high-precision flip-chip bonders. Compared to traditional stand-alone W2W and D2W clusters, the XBC300 Gen2 D2W/W2W offers a significantly reduced footprint. Investment costs are considerably lower because process modules that are redundant in separate stand-alone systems are only needed once. The XBC300 Gen2 D2W/W2W enhances hybrid bonding process development for advanced 3D stacking applications such as system-on-chip (SoC) and stacked IC (SIC).

Highlights

• Ideal for Research and Technology Organizations (RTOs)
• Enabling parallel development and qualification of hybrid bonding processes
• Integrated state-of-the-art flip-chip die bonder from SET Corporation SA
• D2W transfer with very low inter-die spacing at maximum yield
• Consistent ultra-high alignment accuracy
• Closed-loop feedback between integrated metrology and bond aligner

XBC300 Gen2 D2W

With the XBC300 Gen2 D2W platform, SUSS presents a fully automated solution for precise die-to-wafer hybrid bonding on 200mm and 300mm substrates. The platform was engineered in close partnership with SET Corporation SA and meets the most demanding inter-die spacing requirements. An industry-leading footprint and post-bond accuracy of less than 200nm specifically address the requirements of advanced 3D IC architecture, especially for high-bandwidth memory applications.  The XBC300 Gen2 D2W is tailored to meet the precise needs of R&D lines or RTOs (research and technology organizations) that want to focus on sequential hybrid bonding. The new platform features an state-of-the-art NEO HB die bonder from technology partner SET Corporation SA, offering +/-100nm alignment accuracy. A high-precision and throughput-optimized metrology station enables in-line verification of the alignment accuracy of D2W bonds across all processes. 

Highlights

• D2W transfer with very low inter-die spacing at maximum yield
• Integrated state-of-the-art flip-chip die bonder from SET Corporation SA
• Closed-loop feedback between integrated metrology and bond aligner

XBS300 W2W Hybrid Bonder

Permanent Wafer Bonding Platform for R&D and High-Volume Production

The universal XBS300 W2W platform is designed for (hybrid) fusion bonding of aligned 200 mm and 300 mm wafers. Its highly modular design offers maximum configuration flexibility at low cost-of-ownership for customers. Different configurations are available to meet the requirements in both R&D and high-volume manufacturing (HVM) environments. The new XBS300 hybrid bonding platform allows for both collective D2W (die-to-wafer) and W2W (wafer-to-wafer) hybrid bonding focusing on most demanding applications such as 3D stacked memory or 3D SOC (system-on-chip).

Highlights

• Industry leading < 100 nm (3σ) overlay
• High-performance integrated metrology
• Reflective IR option

• Compatible with silicon or glass carriers
• Closed-loop feedback between integrated metrology and bond aligner

XBS300 Temporary Bonder

Universal Temporary Wafer Bonder for High Volume Manufacturing

SUSS MicroTec's XBS300 platform for temporary bonding represents the next generation of high-volume manufacturing temporary bonder solutions. 

Highlights

• Compatible with Silicon or Glass Carriers
• Notch and Center Alignment for Same or Different Size Carriers
• Best in Class TTV with SUSS Patented GYRSET®
• Built-in Metrology for Non-Contact, Multi-Point Thickness Control
• Modular Design for Scalable Throughput and Minimized Footprint
• Open Platform Supporting Various Bonding Materials

XBC300 Gen2 Debonder & Cleaner

Open Platform for More Flexibility

The XBC300 Gen2 debonder and cleaner platform is designed for processing wafers of 200 and 300 mm in size as well as oversized carriers. Sophisticated processing allows for handling of tape mounted device wafer as thin as 50 µm or even below. 

Highlights

• Open platform supporting various materials and technologies
• Room temperature debonding technologies
• Tape mounted thin wafer cleaning with tape protection
• High throughput

XBS200 Wafer Bonder

Wafer Bonding Platform for High-Volume Production

The universal XBS200 platform allows for aligned wafer bonding of wafer sizes up to 200 mm. Its versatility and modular design offer maximum process flexibility in all permanent bonding tasks. A novel aligned wafer transfer method eliminates the complexity of traditional systems and offers consistent process results with excellent system availability. 

Highlights

• Submicron alignment accuracy
• Integrated metrology option
• Unique laser pre-bond option
• High process repeatability
• Low cost of ownership