Overview
Bay Photonics are experts in the design of semiconductor-based photonic component packaging and manufacture of photonic components (e.g. emitters, detectors and photonic ICs).
Bay takes bare semiconductor and silicon photonics die, connecting them electrically and optically to the outside world whilst ensuring the package is mechanically robust and under thermal control.
Core technologies include wire-bonding, diebonding (including flip chip) coupled with sub-micron precision alignment of optical fibres, fibre arrays and micro-optics. Photonic components, such as lasers, waveguides, and photodetectors, require precise alignment to function correctly.
Bay Photonics’ cuttingedge technologies encompass the gamut of downstream semiconductor processes and offers comprehensive support for diesingulation, die-attachment, wire-bonding, encapsulation (ensuring mechanical protection, electrical insulation, photonic connection and thermal control for the encapsulated die), final testing and assembly (integration of photonic integrated circuits into products such as sensors, transmitters and receivers).