WA NEW TECHNOLOGY CO., LTD.

新竹縣,  HSINCHU 
Taiwan
  • Booth: Q5437

歡迎隨時與我們聯絡，為您提供最佳的服務與解決方案!

Overview

華維新科技深耕半導體封裝領域20年，擁有美、日、韓、中國際合作夥伴，能提供您專業可靠的半導體封裝解決方案!

Categories

203 Equipment, Inspection & Measurement
  • Acoustic Spectroscopy; Electron Spectroscopy for Chemical Analysis (ESCA); Ultrasonic; Acoustical Mi
  • Air Velocity (VA) Humidity and Moisture Sensing
  • Centrifuges
  • Chromatograph
  • CV (capacitance-to-voltage) Probe systems
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Die Inspection; Die Shear
  • Fiber Optic Inspection Instruments
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
  • Flat; Notch Finding System
  • Instruments; Bench Top Test
  • Leak Detection Systems - Vacuum or Gas
  • Line Width; Critical Dimension (CD) Measurement
  • Microscopes: Atomic Force Microscopes (AFM)
  • Microscopes: Confocal Scanning Microscope; 3-D Video Microscopes
  • Microscopes: Optical Microscopes
  • Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr
  • Overlay Measurement
  • Package Inspection; Lead Scanners
  • Particle Monitors; Analyzers - Airborne or Liquid
  • Plate Inspection Equipment
  • Resistivity Measurement; 4 point probe; Sheet resistance
  • Spectrometers; Fourier Transform Infrared (FTIR); Attenuated Total Reflectance FTIR (ATR-FTIR); Auge
  • Stress; Refractive Index; Reflectivity & Conductivity Measurement
  • Thermal Sensing, Measurement, Analysis
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
  • Weight measurement; precision scales
  • Wire Bonding Inspection; Test
  • X-ray; XRF; 3-D X-Ray; LEXES Systems
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