F&K Delvotec Bondtechnik Singapore Pte Ltd

Advantages

• Integrated thin wire and deep access applications in a single machine platform through fast system change-over
• Solutions for any customer requirements from prototyping to series manufacture
• Ensure repeatable bond quality through patented BPC for real-time adjustment of the bond parameters with varying material surfaces
• Ensures process transparency through seamless intergration in industry 4.0 / IOT procedures
• Shortens set-up times through intelligent pattern recognition with multiple structure and feature identication

Advantages

• Integrated heavy wire and heavy ribbon in one machine platform through fast system change-over
• Ensure repeatable bond quality through patented BPC for real-time adjustment of the bond parameters with varying material surfaces
• Ensures process transparency through seamless intergration in industry 4.0 / IOT procedures
• Offers process stability through a large choice of ultrasonic frequencies for optimum material matching
• Integrated process technology and automation from a single source

Advantages

• Integrated thin wire and deep access applications in a single machine platform through fast system change-over
• Solutions for any customer requirements from prototyping to series manufacture
• Ensure repeatable bond quality through patented BPC for real-time adjustment of the bond parameters with varying material surfaces
• Ensures process transparency through seamless intergration in industry 4.0 / IOT procedures
• Shortens set-up times through intelligent pattern recognition with multiple structure and feature identication

Advantages

• Integrated heavy wire and heavy ribbon in one machine platform through fast system change-over
• Ensure repeatable bond quality through patented BPC for real-time adjustment of the bond parameters with varying material surfaces
• Ensures process transparency through seamless intergration in industry 4.0 / IOT procedures
• Offers process stability through a large choice of ultrasonic frequencies for optimum material matching
• Integrated process technology and automation from a single source

Advantages

• The best of both worlds: Combination of laser welding and wire bonding
• Higher current carrying capability with lager connector cross sections compared to ultrasonic wire bonding
• Lower manufacturing costs through reduced demands on the surface quality of the parts to be connected
• Allows XYZ positional tolerance compared to laser welding through  use of the touch down sensor and pattern recognition
• No damage to parts because of lower clamping forces in the work holder
• Combines two processes in a single machine without modification:​  1- Laser bonding of ribbon   2- Laser - tab - bonding of connection