SurfCon®
Bio-Inspired Innovative Non-Slip Pad for Semiconductor Wafer Handling
Glint Materials has been the first pioneering company developing and manufacturing bio-inspired dry adhesive pads
especially for semiconductor industry that requires precise substrate handling. Our top priority is to contribute customers' success
and continuous improvement. Please feel free to contact us with your problems over semiconductor wafer handling.
We will do our best to resolve your problems.
SurfCon® Bio-Inspired Innovative Non-Slip Pad for Semiconductor Wafer Handling
Specialized for the applications that requires strong lateral friction but no stickiness.
SEMI compliance material properties.