Overview
TherMap Solutions is a spin-out from the University of Bristol that designs and manufactures advanced laser-based thermal characterisation instrumentation. These tools enable accurate and reliable measurements of critical thermal properties, which are increasingly important as power density in semiconductor devices rises.
Effective thermal management depends on optimising interfaces and bonding layers (e.g., die attach) for efficient heat extraction. Conventional techniques struggle to characterise the thermal properties of complex multilayer structures. TherMap’s commercially available instruments overcome this challenge by providing accurate in-situ measurements across a variety of materials— from epitaxial thin films to die attach layers— facilitating faster R&D feedback and improved quality control.
The technology helps semiconductor companies manufacturing high-power devices accelerate thermal design optimisation and ensure consistent thermal performance and production reliability. TherMap has collaborated with leading academic and industry partners, including the University of Oxford, IMM-CNR (Italy), Soitec (France), and QFI (USA).
Collaboration Opportunities
• Collaborative R&D projects to validate the existing characterisation technology, focusing on thermal challenges in die bonding or advanced packaging for GaN/ SiC-based power/RF devices or AI/HPC chips
• Joint development and integration of in-line thermal characterisation tools for quality control of critical interfaces (die/module attach) in both power/RF and advanced AI/ HPC chip packaging
• Partnership for developing and validating a combined laser-based thermal-ultrasonic metrology system for thermal and structural analysis, including defect detection (e.g., voids, delamination)
• Collaborations with manufacturers facing thermal challenges in high-power devices (SiC/GaN, AI/HPC) to co-develop efficient cooling solutions