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Tomocube, Inc

Yuseong-gu,  30 
Korea (South)
https://www.tomocube.com
  • Booth: N0055

Holotomography, Deep Insights from Surface to Substrate.

Overview

🔷 Tomocube Inc.
Pioneering Industrial Holotomography
Deep Insights from Surface to Substrate

Tomocube Inc. is the global leader in Industrial Holotomography, an advanced 3D optical imaging technology that enables quantitative, non-destructive analysis of internal structures across a wide range of transparent and semi-transparent materials.

Our proprietary holotomography platform provides high-resolution, refractive index-based 3D imaging without the need for physical cross-sectioning or destructive sample prep.
The result: Real-time, volumetric insight into structures below the surface, enabling process engineers and quality teams to detect defects early, optimize parameters, and improve yield.


Key Applications across Industries

🔹 Glass Substrate Processing
• Detect cracks, residues, and voids in TGV/Blind Via
• Visualize taper angle, hole completeness, and inner-wall roughness
• Monitor laser modification and etching behavior quantitatively

🔹 Semiconductor Packaging
• Measure Cu pad recess and shape deformation in hybrid bonding
• Analyze line width and thickness in fine RDL patterns
• Quantify surface roughness of dielectric layers and trenches

🔹 Photonic Integrated Circuits (PICs)
• 3D characterization of optical waveguides
• Evaluate RI uniformity and structural alignment in transparent layers

🔹 Display Industry (AR/XR, MicroLED, MLA)
• Inspect micro display pixel structures
• Visualize and analyze Micro Lens Arrays (MLA) alignment and shape
• Non-destructive inspection of embedded components under transparent layers


Tomocube’s holotomography modules are being adopted by metrology tool makers, display and semiconductor manufacturers, and research centers around the world.
We continue to expand industrial applications through partnerships with process equipment manufacturers and system integrators.

✨ Experience the unmatched depth and precision of Holotomography – now made for industrial use.


✉️ For more info or partnerships, visit us at Booth #N0055, SEMICON Taiwan 2025


  Products

  • HOLOTOMOGRAPHY TRANSMISSION
    The Tomocube HT-T1 offers high-resolution 3D imaging of refractive index variations, enabling precise analysis of TGV inner wall roughness, laser-induced changes, micro-cracks, and silicon photonic waveguides - ideal for advanced inspection and metrology....

  • 🔬 HT-T1 Overview

    The HT-T1 is a high-resolution transmission-mode holotomography system optimized for transparent sample inspection. With 161 nm optical lateral resolution, it visualizes internal 3D structures through quantitative refractive index imaging—ideal for R&D and metrology applications.


    🎯 Key Applications

    • 💥 Laser-induced modification analysis

    • 🔍 Micro-crack detection and morphology mapping

    • 🧱 TGV structure and inner wall roughness inspection

    • 📡 Photonic waveguide geometry and uniformity evaluation


    🖥️ HT-T1 Desktop

    A ready-to-use system combining:

    • Imaging hardware, motorized stage, and measurement software

    • 📏 Supports coupon samples or substrates under 200 × 200 mm

    • 🧪 Ideal for material research, failure analysis, and optical component evaluation

    • 📊 Includes tools for 3D visualization, quantitative analysis, and reporting


    🧩 HT-T1 Module

    An OEM-friendly version for equipment manufacturers:

    • 🔧 Delivers optical hardware with software interface API

    • 🛠️ Allows seamless integration into metrology and inspection tools

    • 🔗 Ideal for semiconductor, display, and photonics system integration

  • HOLOTOMOGRAPHY REFLECTION
    The Tomocube HT-R1 offers 130 nm resolution and 0.1 nm surface sensitivity in reflection mode, enabling 3D imaging of opaque and transparent samples. It supports Cu recess, roughness, CD, step height, and micro display structure measurements....

  • 🔍 HT-R1 Overview

    The HT-R1 is a high-resolution, reflection-mode holotomography engine optimized for OEM integration into advanced inspection and metrology tools.

    • 🎯 130 nm Optical Lateral Resolution

    • 📏 0.1 nm Surface Sensitivity

    • 🧩 Compact and Modular Design for seamless equipment integration

    • 📡 Supports both opaque and transparent sample imaging


    🚀 Key Applications

    • 🔧 Cu Recess & Surface Roughness Measurement in hybrid bonding

    • 🎞️ Critical Dimension (CD) & Step Height Analysis of transparent films

    • 📺 Micro Display Structure Inspection


    🛠️ Designed for Equipment Manufacturers

    With robust software APIs and flexible control options, the HT-R1 Module empowers system builders to embed non-destructive 3D metrology into next-generation semiconductor, display, and packaging equipment.

    Achieve high-throughput, high-precision, and high-value inspection—all in one module.