Providing Ion Beam Etch and Milling Solutions
Overview
Intlvac’s Ion Beam Etch & Milling (IBE) platforms deliver precision dry-plasma etching using a remote broad-beam ion source in high vacuum, enabling high-resolution layer removal and deposition control. The versatile Nanoquest series (Nanoquest I, II, III/IV) supports substrates up to 4″–6″, in both single-wafer and batch configurations, offering scalable solutions across dielectric, metal, and semiconductor films. Adjustable ion energy, current density, and beam incidence deliver finely tunable etch profiles with minimal damage—ideal for delayering ICs, planarization, failure analysis, and advanced nanofabrication workflows.
In addition, Intlvac offers specialized Lithium Niobate (LiNbO₃) etching and milling, enabling clean, high-precision patterning of this critical electro-optic and piezoelectric substrate for photonic, acoustic, and modulator devices. Custom tool configurations ensure minimal redeposition and thermal drift, yielding smooth surfaces and accurate feature control.