AMIES

Shanghai,  China
http://www.amies.com.cn
  • Booth: N0592

Categories

200 Equipment, Assembly
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
    • 202 Equipment, General Use
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
    • 204 Equipment, Mems
  • Wafer Level Bonders
    • 207 Equipment, Process
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
  • Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment
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