Within, the Future
Overview
Maxell Group aims to enchance both social and economic value, by solving customer's issues through our unique Analog Core Tecnologies of ''Mixing & Dipersion'', ''Fine Coating'' and ''High Precision Molding & Forming'' cultivated since its foundation, and by earning customer's recognition that we are ''indispensable''.
The needs for technology in semiconductor manufacturing process have been growing lager and lager in accordance with the recent downsized electronic devices and growing demand for semiconductor chips. Also, we are required to comply with a new manufacturing process for ultrathin wafers led by technology innovation.
Maxell provides you with the best possible solution in semiconductor manufacturing process.
Process tape product line up
・Dicing tape/6360 series
・Heat resistance, Anti-static UV dicing tape
・Back grinding tape
・Other tapes for use in semiconductor manufacturing processes