Nanofilm Technologies International Limited

Singapore,  Singapore
https://www.nti-nanofilm.com/
  • Booth: N0376

Advanced Coating Solution for Semiconductor Manufacturing

Overview

Founded in 1999 and headquartered in Singapore, NTI Nanofilm is a global leader in nanotechnology solutions, specializing in advanced coatings, thin-film equipment, nanofabrication, and hydrogen fuel cell innovations. Leveraging proprietary technologies, the company enhances product performance, durability, and sustainability across industries, including electronics, automotive, medical, and industrial applications.

With a strong international footprint, NTI Nanofilm operates offices and facilities in Singapore, Vietnam, China, Japan, India, and Germany, serving customers worldwide with cutting-edge materials science and precision engineering solutions. Listed on the Singapore Exchange since 2020, NTI Nanofilm is committed to driving innovation and sustainability in high-performance coatings and advanced materials.

  Products

  • TAC-ON®
    TAC-ON® is a patented technology in Tetrahedral Amorphous Carbon (ta-C) Coating, revolutionizing the industry with superior quality and unique characteristics...

    • TAC-ON® offers exceptional hardness, low friction, and superior defect reduction, significantly boosting yield and overall production reliability. 
    Ideal for wafer lapping carriers, lead frame carriers, and advanced semiconductor tools, TAC-ON® delivers turnkey tribological solutions.

    TAC-ON® Outperforms Normal DLC

    TAC-ON® Normal DLC
    Diamond Contant (%) ~ 85 ~ 25
    Hardness (Gpa) ~ 40 ~ 15
    Wearing Rate (mm³/Nm) < 10 -8 ~ 8 x 10 -8
    Friction Coefficient ~ 0.1 ~ 0.14
    Typical Thickness (nm) ~ 1,200 ~ 2,000
    Coating Technology FCVA Normal PVD

  • MICC®
    MiCC® (Micro/Nano-Crystalline Chrome Nitride Ceramic Coating) is an environmentally-friendly solution for the Semiconductor and Electronics industries. It is commonly applied on the IC encapsulation, plastic injection, and rubber molding tooling....

    • MiCC® delivers outstanding durability, smooth release, and minimal contamination while ensuring consistent performance.

    Ideal for IC encapsulation and rubber tooling applications. It reduces defects, and enhances efficiency in semiconductor fabrication and assembly applications. Achieve flawless semiconductor outcomes.

    Coating Composition CrN
    Coating Thickness (um) 1-4
    Micro-hardness (hv) 1,800
    Coefficient of Friction <0.11
    Coating Temp (0C) 150
    Max Service Temp (0C) 700 
    Color Silver
  • Anti-Static Discharge Coating (ASD)
    Customized surface solution to solve electrostatic discharge (ESD) damage in semiconductor manufacturing...

    • ASD protects sensitive semiconductor components from electrostatic damage and static discharge risks, ensuring enhanced reliability and consistent performance across all manufacturing stages.

    Ideal for wafer processing, chip packaging, and assembly, our ASD solution delivers robust protection in critical semiconductor applications with precision

    Coating Compositions taC + DLC
    Coating Thickness (um) 4-6
    Micro-hardness (hv) 2,500
    Coefficient of Friction <0.1
    Coating Temp (0C) <200
    Max Service Temp (0C) 400
    Dark Brown Dark Brown

Categories

200 Equipment, Assembly
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Lead Frame Taping Systems
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Molding; Encapsulation; Decapsulation Equipment
  • Package Handling; Conveying Equipment
  • Solder Reflow; Soldering & Brazing Equipment
  • Wafer Mount; Taping Equipment
  • Wire Bonding Equipment
    • 203 Equipment, Inspection & Measurement
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
    • 205 Equipment, Nanotechnology
  • Equipment, Nanotechnology Tools
    • 206 PV Equipment
  • Thin Film
    • 207 Equipment, Process
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
    • 300 Materials, Assembly
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
  • Lead Frames & Headers: Etched; Stamped
  • Molding; Encapsulation; Potting; Resin Materials
  • Package Substrates; Laminate; Film based
  • Packages; Ceramic and Other High Temp Compounds
  • Packages; Plastic
  • Printed Circuit Boards (PCB); Printed Wire Boards (PWB)
  • Scribe Tools; Saw or Dicing Blades and Accessories
  • Solder; Solder Balls and other Soldering Materials
  • Thermal Interface Materials; Heat Sinks
  • Thin Film; Dielectric Film Materials
    • 301 Materials, Chemicals & Solids
  • Photo Resist; Developers & Ancillaries (incl. Adhesion promoter (HMDS); Primer; Anti-Reflective Coat
  • Surface protection material; coatings
    • 305 Materials, Nanotechnology
  • Materials, Nanotechnology
    • 307 Materials, Process
  • CMP; Grind; Lap; Polish; Abrasive materials
  • Deposition/Target Materials
  • Plasma; Ion Sources
  • Plating Materials
    • 308 Materials, Substrate
  • Compound Semiconductor substrates (GaAs on Silicon; GaN; InP; SiGe, etc.)
  • Diamond substrates
  • Silicon on Insulator (SOI); Silicon on Sapphire (SOS); Silicon Carbide;
  • solar cell substrates; crystalline silicon (c-Si); thin film
  • Substrate Materials
  • Thin & Thick film substrates for MEMS
    • 400 Components, Parts & Accessories
  • Bearings; Shaft Collars
  • Chucks for Wafer and other Substrates
    • 502 Material Handling Systems
  • Static; ESD Control
    • 700 Manufacturing Services
  • Deposition Service
  • Micro Machining services (small hole drilling and milling)
  • Plating; Electro Polishing; Coating; Surface Treatment
    • 701 Manufacturing Services or Consulting
  • Static; ESD Testing & Control Services
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