Overview
Optispac is committed to providing high-reliability multi-chip module packaging structure solutions for global system integration packaging customers, and creatively integrates functional SOP system integration packages composed of a variety of complex materials and temperature gradients through a variety of interdisciplinary technologies, from the perspective to meet the high reliability requirements of the package module such as structural support, optoelectronic feedthrough, isolation shielding,hermeticity, thermal management and environmental adaptability protection, providing customers with a system package with higher integration and more reliable solutions. A convenient and reliable way to realize a wide process feasibility , greatly reducing the difficulty and threshold of multi-chip module system integration packaging.
Products