Overview
RAM Innovations is a UK leader in heterogeneous PCB embedded die packaging, specialising in advanced techniques for wide band gap (WBG) semiconductors used in power applications. As the only UK company offering heterogeneous panel-level packaging, RAM has developed a patented process to embed bare WBG semiconductors within PCBs rather than mounting them on the surface.
This innovation shortens power loops, reduces parasitic inductance, improves circuit efficiency, lowers energy use, and significantly reduces module size and weight—key benefits across automotive, aerospace, defence, and medical sectors. The method also addresses cooling and coefficient of thermal expansion (CTE) challenges common in high-power packages.
RAM’s technology has been validated through reliability testing by the Compound Semiconductor Applications Catapult (1000 thermal cycles from –40°C to +125°C) and by the National Physical Laboratory for its sinter die attach and electrical attach processes. The company’s lean, automated manufacturing process is gaining global traction, serving major US power customers, UK firms, and SMEs. RAM is also in discussions with high-volume fab plants globally, including potential collaborations with foundries in Taiwan.
Collaboration Opportunities
• GaN, SiC, and Si bare die suppliers
• Partners who can copper-metalize and dice wafers
• Organisations seeking scalable, cost-effetive power module packaging lines
• Collaboration partners for R&D funding
• Commercial opportunities around power-dense WBG power modules