Samwell Testing Inc.

MEMS 裝置的動態特性測量和視覺化機械響應對於產品開發、故障排除和有限元素模型驗證非常重要。 Polytec 的 MSA 微型系統分析儀可提供快速、準確的面外 (OOP) 和麵內運動 (IP) 光學測量。到目前為止，這僅限於可光學存取的未包裝設備。現在，Polytec MSA-650 IRIS 微型系統分析儀甚至可以透過封裝微結構（例如慣性感測器、MEMS 麥克風、壓力感測器等）上的完整矽蓋進行測量。

Dynamic characterization of MEMS devices to measure and visualize mechanical response is important for product development, trouble shooting and FE model validation. The MSA Micro System Analyzers from Polytec provide fast, accurate optical measurements of out-of-plane (OOP) and in-plane motion (IP). Until now, this has been limited to unpacked devices that are optically accessible. Now, the Polytec MSA-650 IRIS Micro System Analyzer allows even measuring through intact silicon caps on encapsulated microstructures like e.g. inertial sensors, MEMS microphones, pressure sensors and more

TopMap Micro.View ® + 是新一代光學表面輪廓儀。這款綜合工作站專為模組化而設計，允許自訂和特定於應用程式的配置。 Micro.View ® + 可對錶面粗糙度、紋理和微觀結構形貌進行最詳細的分析。將 3D 數據與顏色資訊結合，實現令人驚嘆的可視化和擴展分析，例如缺陷的詳細文件。高解析度 5 MP 相機可提供工程表面極其詳細的 3D 資料視覺化。

TopMap Micro.View®+ is the next generation optical surface profiler. Designed for modularity, this comprehensive workstation allows for customized and application-specific configurations. The Micro.View®+ delivers the most detailed analysis of surface roughness, texture and microstructure topography. Combine 3D data with color information for amazing visualizations and extended analysis like detailed documentation of defects. The high-resolution 5 MP camera delivers incredibly detailed 3D data visualization of engineered surfaces.

PSV QTec 掃描測振儀以無與倫比的光學靈敏度將全場振動測繪提升到新的水平！他們的創新專利 QTec ® 技術採用基於紅外線 (SWIR) 雷射的多路干涉測量法，可在 DC 至 25 MHz 的所有表面上進行高保真度測量。 PSV QTec 顯著縮短測試時間 - 特別是在黑暗、生物、旋轉或移動物體上，確定 NVH、聲學、結構動力學、超音波、FEM 驗證和無損檢測的操作偏轉形狀和本徵模式。

PSV QTec Scanning Vibrometers take full-field vibration mapping to the next level with unrivalled optical sensitivity! Their innovative, patented QTec® technology uses multi-path interferometry based on infrared (SWIR) laser granting high-fidelity measurements on all surfaces from DC to 25 MHz. PSV QTec significantly reduce testing time - especially on dark, biological, rotating or moving objects, determining operational deflection shapes and Eigenmodes for NVH, acoustics, structural dynamics, ultrasonics, FEM validation and NDT.