Overview
Next-Gen Thermal Conductivity Device to Speed Up High-Heat Chip Thermal Design
[SS-H/M20 for TIM Evaluation]
Your solution for next-generation package thermal management. Our proprietary high-precision steady-state method delivers ultra-accurate "thermal contact resistance" measurements for greases and thermal pads. By bridging the gap between simulations and real-world performance, it helps you achieve optimal thermal design.
[TA for Heat Spreader Evaluation]
Unlock the potential of hard-to-measure, ultra-high thermal conductivity materials. Accurately measure cutting-edge materials like graphite sheets and synthetic diamonds—where conventional testers fall short. We empower the next level of heat dissipation in advanced packaging, driving the market led by Taiwan.
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