Overview
Advanced Ceramic Solutions for Semiconductor & AI Thermal Management
Founded in 2001, COHO Advanced Materials Tech. Co., Ltd. specializes in advanced ceramic materials, precision ceramic components for semiconductor equipment, and high-performance thermal management solutions for semiconductor processing, AI/HPC, power electronics, advanced packaging, and optical communications.
To meet increasing demands for high thermal conductivity, electrical insulation, low thermal expansion, plasma resistance, and reliability, COHO develops advanced ceramics including Aluminum Nitride (AlN), Alumina (Al₂O₃), Zirconia (ZrO₂), Silicon Nitride (Si₃N₄), and Silicon Carbide (SiC).
For semiconductor equipment, COHO provides precision ceramic components for Dry Etch, PECVD, and related processes, including Ceramic Nozzles, Liners, Focus Rings, Spacers, Baffle Plates, Lift Pins, and customized Chamber Components.
For AI servers, GPUs/ASICs, power modules, and high-power electronics, COHO focuses on AlN Substrates, AlN Heaters, AlSiC Thermal Management Components, and high-thermal-conductivity insulating ceramics, providing solutions with high thermal conductivity, electrical insulation, low CTE, and high reliability.
For 3DIC, Chiplet, Silicon Photonics, and Co-Packaged Optics (CPO), COHO develops high-thermal-conductivity ceramic substrates, precision ceramic structures, and ceramic components for optical alignment to support AI computing, high-speed optical interconnects, and advanced packaging.
COHO integrates material development, powder processing, CIM, MIM, Tape Casting, sintering, precision CNC machining, and quality verification. From material selection and DFM to prototyping and mass production, we provide comprehensive Advanced Ceramic Solutions.
With over two decades of precision ceramic manufacturing experience, COHO continues to advance material engineering and manufacturing technologies for next-generation semiconductor and AI applications.
Products